SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
                                                                                                           
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0.015mm Palladium Coated Copper Bonding Wire Anti-Oxidation Advanced CSP IC Packaging Wire

Price Negotiable
Price: 999
MOQ: 1PC
Delivery Time: 5-8 WORKING DAYS
Brand: WINNER
Product Description
0.015mm Palladium Coated Copper Bonding Wire Anti-Oxidation Advanced CSP IC Packaging Wire
Ultra-fine 0.015mm Pd coated copper wire with compact palladium layer, stops copper oxidation, perfect for miniaturized CSP advanced chip packaging.


  • Superior cost-effectiveness compared to gold bonding wire
  • Excellent performance in semiconductor packaging applications
  • Widely accepted and implemented across the industry
  • Maintains reliability and bonding quality standards

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Company SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
Location B105, 90-5 Dayang Road, Rentian Community, Fuhai Street, Bao'an District, Shenzhen,P.R.China
Contact Person Jiang

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