0.015mm Palladium Coated Copper Bonding Wire Anti-Oxidation Advanced CSP IC Packaging Wire
Price:
999
MOQ:
1PC
Delivery Time:
5-8 WORKING DAYS
Brand:
WINNER
Product Description
0.015mm Palladium Coated Copper Bonding Wire Anti-Oxidation Advanced CSP IC Packaging Wire
Ultra-fine 0.015mm Pd coated copper wire with compact palladium layer, stops copper oxidation, perfect for miniaturized CSP advanced chip packaging.
- Superior cost-effectiveness compared to gold bonding wire
- Excellent performance in semiconductor packaging applications
- Widely accepted and implemented across the industry
- Maintains reliability and bonding quality standards

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Company
SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
Location
B105, 90-5 Dayang Road, Rentian Community, Fuhai Street, Bao'an District, Shenzhen,P.R.China
Contact Person
Jiang