Wide Process Window 0.03mm Pd Coated Copper Wire BGA Semiconductor Test Socket Bonding Wire
Price:
999
MOQ:
1PC
Delivery Time:
5-8 WORKING DAYS
Brand:
WINNER
Product Description
Wide Process Window 0.03mm Pd Coated Copper Wire BGA Semiconductor Test Socket Bonding Wire
Adaptable to different bonding machine parameters, high stitch pull strength for BGA semiconductor test socket packaging.
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Company
SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
Location
B105, 90-5 Dayang Road, Rentian Community, Fuhai Street, Bao'an District, Shenzhen,P.R.China
Contact Person
Jiang