Nonmetal Solar Module Production Line Non-Destructive Dicing Machine 10kW Rated Power with 3600 pcs/h Capacity
Price:
43000 USD
MOQ:
1 SET
Delivery Time:
30 days after payment
Brand:
X-SOLAR
Product Description
Automatic Non-Destructive Dicing Machine
This advanced dicing machine is specifically designed for solar module production, offering precision cutting with minimal material damage and high throughput capabilities.
Key Features
- Compatible with solar cells ranging from 156-230mm
- Flexible switching between specifications without part replacement
- 12-megapixel industrial camera for high-resolution positioning
- Imported lasers with independent control for each unit
- High operational efficiency and precision
Technical Specifications
| Parameter | Specification |
|---|---|
| Designed Production Capacity | ≥3600 pcs/h |
| Dicing Function | 1/2, 1/3, 1/4 |
| Utilization Rate | 98% |
| Solar Cell Type | Monocrystalline/Polycrystalline Solar Cell |
| Cell Size | 156-230mm |
| Cell Thickness | 0.14-0.2mm |
| Dicing Precision | ±0.1mm |
| Defect Rate | ≤0.05% |
| Loading Inspection Resolution | 0.3mm |
| Power | Rated Power 10kW, Peak Power 15kW |
| Air Consumption | 0.5m³/min |
| Weight | 3.5T |
| Equipment Dimensions | L3858mm × W1850mm × H2454mm |
Precision and Quality Advantages
High Precision Cutting
Achieves smooth, clean cuts with minimal kerf width, essential for semiconductor and electronics applications where exact dimensions are critical.
Minimal Material Damage
Non-destructive cutting process maintains material integrity and properties, particularly important for sensitive semiconductors, wafers, and fragile components.
Frequently Asked Questions
Working Principle
What is the basic working principle of a non-destructive dicing machine?
Non-destructive dicing machines use techniques like laser cutting, waterjet cutting, or ultrasonic cutting. Laser cutting employs a focused beam to vaporize or melt material along the cutting path precisely, while waterjet cutting uses high-pressure water streams to erode material without significant damage.
How does laser-based non-destructive dicing differ from traditional mechanical dicing?
Traditional mechanical dicing uses cutting tools that cause mechanical stress and damage. Laser-based dicing minimizes mechanical impact, allowing for finer, more precise cuts with less internal structure damage.
Applications
In which industries are non-destructive dicing machines commonly used?
Widely used in semiconductor industry for wafer dicing, electronics manufacturing for circuit boards, optical industry for lens shaping, and medical device manufacturing for precision parts.
Can non-destructive dicing machines be used for cutting flexible materials like polymer films?
Yes, certain types with appropriate parameters can effectively cut flexible materials without deforming or damaging functionality.
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Jiangsu X-solar Green Building Technology Co., Ltd.
Location
No.1011, Zhengcheng Road, Jiangyin city, Jiangsu Province, China 214400
Contact Person
Kevin