Lead Free Mini Desktop Reflow Oven with Dual Heating System for SMT Soldering and PCB Assembly
Price:
7500
MOQ:
1
Delivery Time:
5-15
Brand:
HXT
Product Description
Lead Free Reflow Oven Machine Mini Desktop For PCB SMT Soldering Assembling Production Line
The Mini Desktop Reflow Oven is a professional-grade, compact thermal processing solution designed for prototyping, low-volume SMT assembly, and R&D. It combines space-saving design with industrial performance, featuring an advanced Dual Heating System that merges Strong 3D Hot Air Circulation with Super Infrared Radiation Heating. This innovative technology ensures precise, even, and efficient heat distribution across the entire PCB, achieving perfect solder reflow profiles for a wide range of lead-free and leaded solders. It is the ideal tool for engineers, labs, makerspaces, and small-batch production.
Product Specifications
| Model | RF-A200 | RF-A250 | RF-A350 | RF-A500 |
|---|---|---|---|---|
| Power Supply | AC220V+10% 50Hz (AV110V Custom-Made) | |||
| Max Power | 700W | 1600W | 2400W | 3600W |
| Heating Method | Infrared Radiation Heating and Hot Air Circulation | |||
| Effective Welding Area | 200x150mm | 250x200mm | 350x300mm | 500x400mm |
| Drawer Size | L250xW180xH20mm | L300xW250xH30mm | L400xW330xH30mm | L550xW430xH30mm |
| Operating System | Chinese and English Bilingual Language Operate System | |||
| Display Mode | Graph Mode/Text Mode and Display Mode Optional | |||
| Temperature Range | Room Temperature -300°C | |||
| Temperature Curve Zones | Preheating Zone, Heating Zone, Holding Zone and Cooling Zone Totally Five Zones | |||
| Outline Size (LxWxH) | 375x350x312mm | 425x400x312mm | 525x500x312mm | 675x600x312mm |
| Weight | 13.5kg | 19kg | 24.9KG | 37.1kg |
Key Features
Advanced Dual Heating System
- Strong 3D Hot Air Circulation + Super Infrared Radiation Heating: This hybrid technology delivers rapid, uniform heating from all directions. The infrared radiation provides direct, efficient energy transfer to components and the board, while the forced 3D hot air eliminates cold spots, ensuring every part of the assembly reaches the target temperature simultaneously.
Superior Thermal Performance
- Heat Circulates Evenly: Patented airflow design and strategically placed heating elements guarantee a consistent temperature gradient across the entire heating chamber, critical for complex or densely populated boards.
- Full Utilization of Thermal Energy: The system minimizes heat loss, translating to faster heating rates, lower energy consumption, and reduced operating costs.
- Balanced Heating: Prevents component damage (tombstoning, cracking) caused by uneven thermal expansion, ensuring higher first-pass yield.
Optimal Welding Quality
- Precision Profile Control: Achieves perfect reflow curves (preheat, soak, reflow, cooling) for various solder pastes, resulting in shiny, reliable solder joints with minimal voids.
- Consistent, Repeatable Results: Essential for process control and quality assurance in professional settings.
User-Centric Design & Control
- Intuitive Touchscreen/Controller: Easily set, store, and monitor custom reflow profiles.
- Compact Desktop Footprint: Saves valuable bench space without compromising on chamber size.
- Robust Safety Features: Includes over-temperature protection, automatic cooling, and safety lock.
Applications
Widely used in electronics manufacturing, consumer electronics, automobile electronics, communications equipment, aerospace, medical equipment, LED lamps, computers and peripherals, smart home, smart logistics, miniature and high power ratio electronic devices.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Shenzhen Hongxinteng Technology Co., Ltd.
Location
Building No. 142 / B311, Songyu Road, Hongxing Community, Songgang Street, Baoan District, Shenzhen China.
Contact Person
Alina