AI-Powered PCB Automated Visual Inspection (AVI) Machine – High-Speed 50μm Precision Optical Inspection Equipment for Solder Mask & Circuit Defect Detection
The PCB Automated Visual Inspection (AVI) System is an advanced optical inspection solution designed for pre-shipment final quality control in printed circuit board manufacturing. Integrating cutting-edge image processing, artificial intelligence, and real-time computing technologies, the AVI system automatically detects surface defects and cosmetic imperfections on PCBs with high speed and precision.
As an intelligent vision-based inspection system, AVI replaces traditional manual visual inspection—which is prone to human error and fatigue—with automated, non-contact inspection that is faster, more consistent, and more accurate. The system is widely used in high-volume, continuous automated production lines for online, non-contact inspection and monitoring.
The AVI system can detect a comprehensive range of surface defects across various PCB surface finishes and board types:
| Category | Defects Detected |
|---|---|
| Solder Mask | Ink buildup, contamination, scratches, missing print, exposure shift, exposed copper |
| Legend / Character | Blurred printing, missing characters, wrong characters, extra printing, wrong color, misalignment |
| PAD (Land Pattern) | Scratches, oxidation, solder mask contamination, nicks, residual copper, contamination, uneven surface |
| Hole / Outline | Missing drill holes, plugged holes, missing routing |
| Gold/Copper Surface | Protrusions, dents, shorts, opens, foreign objects, contamination, missing plating, scratches, nicks, bumps, exposed copper, misalignment |
| Surface Finishes | Supports ENIG (Electroless Nickel Immersion Gold), OSP, Immersion Silver, Immersion Tin, and HASL (Hot Air Solder Leveling) boards |
| Special Features | Selective area inspection (e.g., BGA areas, gold finger seepage detection); customizable detection functions |
Supported board types include rigid PCB, flexible PCB (FPC), rigid-flex PCB, HDI, CSP, BOC, MMC, BGA, IC substrate, and automotive PCB.
| S25 Specifications | |
|---|---|
| resolution ratio | 25um |
| Scan area | 50*110mm-350*500mm |
| thickness range | 0.3-5.0mm (Hold the edge of the board so it doesn't bend naturally) |
| capacity | Single-chip test: 700-1000 sets/hour; dual-chip test: 1400-1800 sets/hour |
| Device size | L 1985mm*W1475mm*H1900mm |
| Weight of equipment | 1600KG |
| language | Chinese or English |
| Producer type | Gerber + physical board production |
| transmission mode | Horizontal belt conveyor |
| Error detection method | Image Comparison + Logic Operation |
| AI Intelligence (optional) | pseudesth esia |
| Defect confirmation | IRS Maintenance Station Confirmation + Body Confirmation |
| automatics | Automatic loading and unloading, automatic staggered arrangement |
| Test board type | Gold-plated, OSP (Organic Solder Paste) coated, selective chemical etched, tin-sprayed, and silver-silvered boards |
The AVI system is specifically designed for final visual inspection of PCBs prior to packaging and shipment. Its core purpose is to identify and sort out defective boards before they leave the factory, thereby:
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Reducing product scrap and rework costs
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Minimizing customer returns and complaints
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Ensuring consistent product quality
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Lowering reliance on manual labor and reducing human inspection costs
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