Krunter Future Tech (Dongguan) Co., Ltd.
                                                                                                           
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BGA Test Socket for DFN Packages - 4 I/O, 1.1mm Pitch, Clamshell Design with Through-Hole Mounting

Price Negotiable
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
Brand: Loranger
Product Description
Product Overview

This BGA test socket features a clamshell design with through-hole mounting, engineered for reliable testing of DFN packages with 1.1mm pitch and 4 I/O configuration.

Key Specifications
Package Type: DFN
I/O Count: 4
Pitch: 1.1 mm
Socket Style: Clamshell
Mounting: Through-Hole
Lead Time: 2 to 4 weeks
Package Dimensions
Body Length (L): 2.5 mm (±0.05 mm)
Body Width (W): 2.00 mm (±0.05 mm)
Body Height (H/T): 0.75 mm
Overall Footprint
Footprint Length: 19.3 mm
Footprint Width: 13.0 mm
Footprint Height: 18.8 mm
Compatible Models

This socket is part of a comprehensive family of test solutions. The item number 03729 041 6217 is specifically configured for 4 I/O DFN packages with 1.1mm pitch.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Krunter Future Tech (Dongguan) Co., Ltd.
Location RM 708, Building A, No.5 Keji No.2 Road, Songshan Lake, Dongguan, P.R.China
Contact Person Jack

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