Loranger Test Socket

Professional surface mount device test sockets offering reliable electrical connections for component testing. Available in multiple I/O configurations (2-24 pins) with precise contact spacing from 0.350mm to 7.690mm. Compatible with SOT-23, SOT-89, DPAK and custom package types. Durable construction ensures repeated testing cycles with customizable options for specialized applications.

Rugged open top and clam shell test sockets with wire-formed contacts for solid device carrier clamping. Accommodate standard carriers in various sizes and I/O counts. Ideal for reliable B2B industrial testing applications.

Advanced BGA test socket designed for DFN packages with 4 I/O configuration and 1.1mm pitch. Features clamshell design, through-hole mounting, and precise internal dimensions of 2.5mm x 2.0mm x 0.75mm. Ideal for reliable IC testing with 2-4 week lead time from Loranger International Corp.

Top-loading Kelvin and non-Kelvin sockets for in-line TO and SIP packages. Custom options available. Fit independent of package dimensions. Supports multiple packages and various pitches.

Precision BGA/CSP test socket featuring 6 I/O configuration with 0.22mm and 0.23mm pitch capability. Designed for reliable burn-in testing with package height variation accommodation, non-magnetic options, and optional heat sink for thermal management during extended test cycles.

This 15-pin test socket supports 0.22mm pitch and greater, accommodating various package heights. Features non-magnetic options, precise fit, and reliable contact between land pad and board pad. Ideal for testing multiple electronic devices at 100V.

Loranger test sockets feature top-loading designs with low insertion force and positive contact wiping action. Available in various I/O counts from 14 to 64 with standard 2.54mm pitch, these sockets provide reliable electrical connections and facilitate easy board cleaning with bottom standoffs.

Loranger's comprehensive gull wing test socket line offers high-performance testing solutions with insulation resistance up to 1000 megaohms. Available in various I/O configurations (2-96 pins) and pitch sizes (0.4-5.46mm), these sockets provide reliable connectivity for SOIC, SSOP, TSSOP, and QFP packages. Designed for burn-in testing and quality assurance applications in semiconductor manufacturing.

Professional ceramic test socket with 0.22mm minimum pitch and 0.20mm contact size compatibility. Features 3500+ socket styles, 1300+ QFN designs, Kelvin configurations, and 50 Ohm termination. Ideal for burn-in testing, measurement applications, and environmental system integration.

Professional 15mm x 15mm test socket featuring Loranger Standard and APS contacts for 0.22mm+ pad pitches. Offers zero-insertion-force design, depth-controlled wiping contacts, and options for case contacts and heat sinks. Supports dynamic, static, and humidity burn-in testing for comprehensive semiconductor validation.

Industrial-grade side-brazed DIP socket with 22 I/O connections and 2.54mm pitch. Features open-top design for easy component access, through-hole mounting for secure PCB installation, and high current capacity. Internal dimensions: 7.75mm length, 25.4mm width, 2.54mm height. Ideal for electronic testing and prototyping applications.

Professional-grade 20-pin DIP socket featuring 2.54mm pitch spacing and side-brazed construction. Open top design allows easy IC insertion while mounting ears ensure secure PCB attachment. Ideal for industrial applications requiring reliable integrated circuit connections with precise 7.75mm body length and 28.19mm footprint dimensions.