Loranger 006004006J6617 BGA/CSP Test Socket - 6 I/O, 0.22/0.23mm Pitch for High-Density IC Testing
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Brand:
Loranger
Product Description
Product Overview
Loranger 006004006J6617 is a precision BGA/CSP test socket designed for high-density integrated circuit testing applications.
Key Features
- 0.22 mm and 0.23 mm pitch capability for ultra-fine pitch components
- 6 I/O configuration for comprehensive testing capability
- Accommodates package height variations for flexible application
- Non-magnetic socket options available for sensitive applications
- Accurate, tightly-controlled package fit ensuring reliable connections
- Contacts connect solder ball directly to board pad for optimal signal integrity
- Optional heat sink for thermal management during extended testing
- Designed for ball grid array and chip scale package applications
Technical Specifications
| Parameter | Specification |
|---|---|
| Item Number | 006004006J6617 |
| Package Type | BGA/CSP |
| Number of I/O | 6 |
| Pitch | 0.22 mm / 0.23 mm |
| Package Height Accommodation | Yes |
| Life Cycle | 000 cycles |
Application Benefits
This test socket provides reliable electrical connections for burn-in and testing of advanced semiconductor packages. The precision engineering ensures consistent performance across multiple test cycles, making it ideal for production testing environments and quality assurance applications.
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Company
Krunter Future Tech (Dongguan) Co., Ltd.
Location
RM 708, Building A, No.5 Keji No.2 Road, Songshan Lake, Dongguan, P.R.China
Contact Person
Jack