How can we start your PCB project?

Please Send your:

• Gerber files: Standard Gerber RS‑274X format for all layers, drill data and profile.
• PCB specifications: Layer count, base material (e.g., high-Tg FR‑4), thickness, copper weight.
• Surface finish: Required plating type (e.g., ENIG, HASL, OSP).
• Mechanical drawing: Custom shape, dimensions, tolerances and mounting details.
• BOM list (if assembly required): Components, quantities, manufacturer part numbers.
• Special notes: Impedance control, testing standards, quality or medical-grade requirements.

High-Density Custom PCB Production Flows:

1.DFM Analysis: First, conduct a design-for-manufacturability review to validate the high-density trace layout and via placement for yield optimization.
2. Layer Stackup Fabrication: Bond multiple copper-clad laminates with prepreg to build the multi-layer structure required for complex routing.
3. Laser Drilling: Use laser micro-drilling to create tiny blind/buried vias, enabling interlayer connections in high-density areas.
4. Electroplating: Plate vias and copper traces to ensure reliable conductivity, with precise thickness control for high-speed signal integrity.
5. AOI Inspection: Deploy automated optical inspection to detect defects in fine-pitch traces and solder mask coverage.
6. CNC Profiling: Cut the board to its custom contour, followed by electrical testing (flying probe) to verify all circuits function as designed.