Customizable FR4 Material HDI PCB with Thermal Resistance and Space Saving for High-Density Applications
Price:
Based on Gerber Files
MOQ:
Sample,1 pc(5 square meters)
Delivery Time:
NA
Brand:
High Density PCB
Product Description
Customizable FR4 Material HDI Multilayer PCB with Thermal Resistance & Space Saving
Why Choose This Board
HDI technology enables next-generation electronics by breaking space constraints while boosting electrical performance. As devices evolve toward smaller form factors with higher functionality, HDI PCBs provide the essential foundation for innovation in 5G, AI, IoT, and portable medical systems.
Core Performance Advantages
- Miniaturization: 50-70% size/weight reduction vs. conventional PCBs
- Enhanced Signal Integrity: Shorter paths reduce inductance/crosstalk (critical for >5 GHz)
- Improved Thermal Management: Dense thermal vias under BGAs
- Higher Reliability: Filled micro-vias resist thermal stress
- Design Flexibility: Supports complex ICs
Structural Configurations
| Type | Structure | Typical Applications |
|---|---|---|
| 1-N-1 | 1 HDI layer sequence | Wearables, Basic IoT |
| 2-N-2 | 2 HDI layers per side | Smartphones, Tablets |
| Any-layer | Micro-vias on all layers | High-end CPUs, GPUs, 5G Modules |
| Full Layer Interconnect Structure | Every Layer Interconnect | Aerospace, Portable Medical Devices |
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Company
Dongguan Xingqiang Circuit Board Technology Co., Ltd.
Location
Zhupingsha Industrial Zone, Wangniudun Town, Dongguan City, Guangdong Province
Contact Person
Kevin