Custom High-Density Gold-Plated FR-4 PCB Multi-Panel for Smart Home Devices
High-Density ENIG FR-4 Multi-Panel PCB Custom for WiFi & Wireless IoT Devices:
This custom multi-panel PCB is specifically engineered for 2.4G/5G WiFi modules, built on high-quality FR-4 substrate with ENIG (Electroless Nickel Immersion Gold) surface finish. It features high-density routing and gold-plated pads, ensuring low signal loss, excellent solderability, and long-term reliability for IoT, smart home, and wireless communication devices. The multi-panel design optimizes manufacturing efficiency and reduces per-unit costs, making it ideal for mass production of compact wireless modules.
What problems can this board solve for you?:
1.Reduces 2.4G/5G signal loss and interference for stable wireless transmission2. Prevents pad oxidation with ENIG finish, improves soldering success rate
3. Saves device internal space via high-density routing for miniaturization needs
4. Cuts unit cost and boosts production efficiency with multi-panel design
5. Enhances durability in complex environments (anti-corrosion, high-temperature resistance)
6. Enables precise mounting of fine-pitch components with smooth gold-plated pads
Customization Service:
Documents Required for Custom High-Density PCB
1. Gerber files (RS-274X): Complete PCB layout with all layers, the core production file.
2. Drill file: Detailed hole size/position for drilling processes.
3. BOM list: Clear specs of materials, surface finish and technical requirements.
4. Design drawing: Marked dimensions, tolerance and assembly notes for confirmation.
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