1.Design Review

First, our engineers check your Gerber files and design data to ensure they meet HDI manufacturing requirements, including trace widths, via sizes, and layer stack‑up.

2.Layer Stack‑up & Material Selection

We select the appropriate materials, such as FR‑4 or high‑TG laminates, and create the multi‑layer stack‑up with signal, power, and ground planes.

3.Laser Drilling for HDI Vias

For HDI boards, we use laser drilling to create small blind and buried vias, which allow connections between inner layers without going through the entire board.

4.Plating & Copper Deposition

The vias are plated with copper to make them electrically conductive, ensuring reliable connections between layers.

5.Lamination

Multiple layers are bonded together under high temperature and pressure to form a solid, unified multi‑layer board.

6.Outer‑Layer Imaging & Etching

The outer‑layer circuits are imaged, etched, and cleaned to create the final trace patterns.

7.Surface Finish (ENIG)

An ENIG finish is applied to provide excellent solderability, corrosion resistance, and long‑term reliability.

8.Electrical Testing

The board undergoes rigorous electrical testing to ensure there are no shorts, opens, or impedance issues.

9.Quality Inspection & Packing

Finally, the PCBs are inspected for quality, then packed and prepared for shipment.