Customized Flexible Printed Circuit Board for with Immersion Gold & OSP Surface Finish

Price Negotiable

Price: Based on Gerber Files

MOQ: Sample,1 Pc(5 Square Meters)

Delivery Time: NA

Brand: Xing Qiang

Product Description

Custom FPC Fabrication for Wearable & Medical Applications:

We specialize in custom flexible printed circuit (FPC) fabrication.We support surface finishes such as ENIG, HASL and OSP, and integrate advanced features like blind microvias, controlled impedance routing, and coverlay protection. Our panelized manufacturing ensures cost efficiency, while rigorous reliability testing (including flexural fatigue and thermal cycling) guarantees performance in dynamic applications like wearables and medical devices.

Technical Parameters:

Product Name	Custom PCB Board
Base Material	Polymide
PCB Size	As per your request
Copper Overall	05-5oz
PTH	0.075Mm
Minimum Line Spacing	3Mil(0.075mm)
Min.hole Size	0.1Mm
Silkscreen Color	White,Red,Black,Yellow
Solder Mask Ink Color	Black/Yellow/Red/White/Blue/Green
Size or Dimension	According To Customer Request

Custom PCBs vs. Off-the-Shelf PCBs::

Aspect	Custom PCBs	Off-the-Shelf PCBs
Design Flexibility	Fully customizable size, shape, layer count, and routing to match product requirements	Fixed dimensions, layouts, and features; limited to standard configurations
Performance & Features	Support HDI, microvias, controlled impedance, and specialized materials/finishes (ENIG, HASL, OSP)	Basic circuitry only; no advanced features, poor impedance control, limited material options
Space & Integration	Optimized for miniaturization, fits compact/irregular form factors (wearables, medical devices)	One-size-fits-all; bulky, wastes space, hard to integrate into slim designs
Reliability	Tailored for harsh environments, with rigorous testing (flex fatigue, thermal cycling)	Generic build; lower durability, higher failure risk in demanding applications
Cost Efficiency	Higher upfront tooling, but lower long-term costs via optimized assembly and mass production	Lower upfront cost, but higher assembly costs, compatibility issues, and redesign expenses