Professional Custom HDI PCB High-Density Circuit Board Manufacturer:

Technical Parameters:

Custom HDI PCB Production Process :

1.Customer File Receipt & Review

Receive Gerber files, BOM, and technical requirements from customers, then conduct a comprehensive DFM (Design for Manufacturability) analysis to ensure manufacturability.

2.Quotation & Order Confirmation

Provide a detailed quotation based on layer count, materials, surface finish, precision, and order quantity. Confirm order details, lead time, and payment terms.

3.Material Preparation

Select and prepare high-quality base materials (FR‑4, high‑TG, high‑frequency, etc.), copper foils, and auxiliary materials according to customer specifications.

4.PCB Fabrication

Carry out inner-layer circuit imaging, etching, AOI inspection, and multilayer lamination. For HDI boards, include laser drilling, microvia formation, and sequential lamination.

5.Plating & Surface Treatment

Perform hole metallization, electroplating, and selected surface finishes such as ENIG, immersion gold, HASL, OSP, or hard gold.

6.Precision Machining

Conduct routing, drilling, gold finger beveling, and silk-screen printing according to custom dimensions and design requirements.

7.Electrical & Performance Testing

Implement electrical testing, impedance testing, high-voltage testing, and reliability inspection to ensure compliance with IPC standards.

8.PCB Assembly (Optional)

Provide one-stop SMT/DIP assembly, component soldering, BOM sourcing, and finished product functional testing.

9.Final Inspection & Packaging

Conduct final visual and quality inspection before vacuum packaging to avoid damage during transportation.

10.Shipment & After-Sales Support

Arrange delivery according to customer requirements and provide after-sales technical support and file archiving.

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