Shaanxi KeGu New Material Technology Co., Ltd
                                                                                                           
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High Thermal Conductivity Boron Nitride Ceramic HBN Components for Exceptional Temperature Resistance and Large Component Capability

Price Negotiable
Price: 200-500 yuan/kg
MOQ: Negotiable
Delivery Time: Negotiable
Brand: KEGU
Product Description
Hexagonal Boron Nitride (HBN) Ceramics for Semiconductor Applications
Hexagonal Boron Nitride (HBN) ceramics deliver exceptional thermal management and electrical insulation for demanding semiconductor manufacturing processes. With graphite-like structure but superior performance, our "white graphite" components maintain structural integrity in extreme temperatures while providing excellent heat dissipation - making them ideal for critical semiconductor equipment applications.
Key Technical Advantages & Performance Features
  • Superior Thermal Management: High thermal conductivity ensures efficient heat dissipation in extreme processing environments
  • Exceptional Temperature Resistance: Maintains structural integrity and performance stability at elevated temperatures exceeding 2000°C
  • Large Component Capability: Advanced hot pressing technology enables production of large-dimension components up to 650mm diameter
  • Enhanced Material Durability: Very low porosity structure provides superior chemical resistance against corrosive semiconductor processing environments
  • Precision Manufacturing Ready: Mohs hardness of 2 allows easy machining into complex geometries with minimal post-processing
  • Net Shape Production: Direct sintering capability reduces material waste and manufacturing costs
Primary Semiconductor Equipment Applications
Gas Distribution & Process Components
  • Gas distribution plates & spray nozzles
  • Top nozzles and baffle assemblies
  • Pedestal heaters & cover plates
High-Temperature Processing Components
  • RF windows & evaporation crucibles
  • Wafer processing components & rings
  • Heat resistant substrates & base materials
Why Choose Our Boron Nitride Ceramics?
Our HBN components are precision-engineered for reliability in the most demanding semiconductor fabrication environments. The unique combination of net-shape sintering capability, large diameter manufacturing (up to 650mm), and exceptional thermal properties makes them the optimal choice for:
  • High-temperature thermal management systems
  • Corrosive environment applications
  • Precision semiconductor manufacturing
  • Custom-shaped components requiring minimal post-processing
Technical Highlights
Boron nitride ceramics for semiconductor equipment
HBN components with 650mm diameter capability
White graphite for high-temperature applications
Thermally conductive electrical insulators
Corrosion-resistant semiconductor components
Hexagonal Boron Nitride ceramic components for semiconductor applications Large diameter HBN ceramic components manufacturing process
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Company Shaanxi KeGu New Material Technology Co., Ltd
Location 5# Chaoyang Road,Weicheng Sub-district,Qinhan New City, Xixian New Area, Xi'an Shaanxi Province,China,712039
Contact Person Yuki

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