China High Purity Approximate Spherical Alpha Alumina Powder with Controlled Particle Size and Optimized Morphology for Thermal Conduction for sale

High Purity Approximate Spherical Alpha Alumina Powder with Controlled Particle Size and Optimized Morphology for Thermal Conduction

Price Negotiable

Price: 200-500 yuan/kg

MOQ: Negotiable

Delivery Time: Negotiable

Brand: KEGU

Product Description

Approximate Spherical Alpha Alumina Powder | High-Purity Thermal Conduction Filler

Enhance Thermal Management with Precision-Engineered Alumina Fillers

Our high-purity approximate spherical alpha alumina powder is specifically formulated to maximize thermal conductivity in polymer composites and thermal interface materials. With controlled particle size distribution and exceptional purity, this advanced ceramic filler enables superior heat dissipation in demanding electronic applications.

Technical Specifications

Parameter	Unit	SW-2	SW-5	SW-8	SW-15	SW-20
Al₂O₃ Content	%	≥99.5	≥99.5	≥99.5	≥99.5	≥99.5
SiO₂	%	≤0.10	≤0.08	≤0.08	≤0.08	≤0.08
Fe₂O₃	%	≤0.03	≤0.03	≤0.03	≤0.03	≤0.03
Na₂O	%	≤0.10	≤0.10	≤0.10	≤0.10	≤0.10
LOI	%	≤0.10	≤0.10	≤0.10	≤0.10	≤0.10
H₂O	%	≤0.10	≤0.10	≤0.10	≤0.10	≤0.10
D50	μm	3.0±0.5	6.5±0.5	9.0±2.0	13.0±2.0	20.0±2.0
Density	g/cm³	0.6±0.2	0.9±0.2	1.0±0.2	1.0±0.2	1.2±0.2
Oil Absorption	%	≤45	≤40	≤35	≤30	≤30

Key Features & Benefits

High Purity Composition: ≥99.5% Al₂O₃ content ensures optimal thermal performance and electrical insulation
Optimized Particle Morphology: Approximately spherical shape enables higher packing density and improved flow characteristics
Controlled Particle Size Distribution: Multiple D50 grades from 3μm to 20μm allow for precise formulation optimization
Reduced Oil Absorption: Lower resin demand enables higher filler loading and enhanced thermal conductivity
Excellent Filling Performance: Designed to maximize particle concentration in composite materials

Primary Applications

Thermal Interface Materials: High-performance thermal greases, gap fillers, and thermally conductive gels
Thermal Management Systems: Thermally conductive gaskets, pads, and phase change materials
Electronic Packaging: Epoxy molding compounds, underfill materials, and encapsulants
Polymer Composites: Thermally conductive plastics, adhesives, and potting compounds

Why Choose Our Alpha Alumina?

Enhanced Thermal Conductivity: High purity and optimized morphology directly improve heat transfer efficiency
Process Compatibility: Excellent dispersion characteristics simplify manufacturing processes
Formulation Flexibility: Multiple size options enable bimodal or multimodal distribution designs
Reliable Performance: Consistent batch-to-batch quality ensures predictable composite properties