GRM601 600 M³/H Dry Vacuum Pump ISO100 KF25
Price:
USD 8,000-13,000 / Set
MOQ:
1 Set
Delivery Time:
15-30 working days
Brand:
GRM
Product Description
GRM601 Dry Vacuum Pump
The GRM601 is a 600 m³/h dry vacuum pump offering low power consumption and high pumping speed. It safely handles flammable, explosive, and condensable process gases, engineered for PECVD, MOCVD, and SIC-CVD semiconductor processes.
Key Features
- Permanent Magnet Synchronous Motor — Delivers superior energy efficiency with industry-leading low power consumption.
- Advanced Rotor Structure — Enhanced dust extraction capability ensures reliable operation in particulate-heavy process environments.
- Dust and Water Vapor Tolerant — Insensitive to dust and water vapor entrained in the pumped gas stream.
- Compact and Integrated Design — Small footprint with high system integration for easy installation in crowded fab environments.
- Comprehensive Protection — Built-in protection functions with strong adaptive capability for varying process conditions.
- Low Vibration and Noise — Operates at ≤63 dB(A) at ultimate pressure for a quieter workplace.
- Advanced Sealing System — Lip seal and labyrinth seal combined with nitrogen purge effectively prevents oil back-streaming, maintaining high vacuum cleanliness in the process chamber.
- Remote Control and Monitoring — Supports I/O interface and RS485 communication (Modbus protocol) for seamless integration into factory automation systems.
- Hazardous Gas Compatible — Safe operation with flammable, explosive, and condensable process gases.
Technical Specifications
| Parameter | Specification |
|---|---|
| Pumping Speed | 600 m³/h |
| Ultimate Pressure | ≤0.15 Pa |
| Rated Power | 1.9+1.9 kW |
| Voltage | 380V Three-Phase |
| Cooling Water Pressure | 0.2-0.6 MPa |
| Cooling Water Flow | ≥4 L/min |
| Cooling Water Temperature | 5-30 °C |
| Cooling Water Connection | G3/8 |
| N2 Purge Pressure | 0.2-0.6 MPa |
| N2 Purge Flow | 12-50 L/min |
| N2 Purge Connection | G1/4 |
| Inlet Connection | ISO100 |
| Outlet Connection | KF25 |
| Noise Level | ≤63 dB(A) |
| Operating Environment | 5~40°C; ≤80% RH |
| Weight | 260 kg |
| Dimensions (L*W*H) | 865*344*751 mm |
Application Processes
Clean Processes
Load-Lock, Transfer, Metrology, Lithography
Medium Processes
PVD Process, PVD Pre-Clean, RTA, Strip/Ashing, Oxide Etch, Silicon Etch, Implant Source, Metal Etch
Harsh Processes
HDP-CVD, RTP, SACVD, MOCVD, PECVD, LPCVD, ALD
Target Industries
- Semiconductor: Etching, ion implantation, CVD, PECVD, MOCVD, and SIC-CVD clean/medium/harsh process applications.
- Photovoltaic: Crystal growth furnaces, cell manufacturing processes.
- Lithium Battery: Cell vacuum drying, electrolyte filling, and degassing processes.
- Flat Panel Display & LED: Manufacturing processes requiring high-cleanliness vacuum environments.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
SUZHOU KACO VACUUM EQUIPMENT CO.,LTD.
Location
#3,No.152 Kangzhuang Rd,Zhoushi Town,Kunshan city,Suzhou,PRC.
Contact Person
Joyce