Modified Hot Melt Glue 93% High Light Transmittance Film Glue
1.Preprocess substrate surfaces to ensure they are completely clean without dust particles and oily residues.
2. Uniformly spread adhesive on substrates adopting coating, screen printing or spray coating techniques.
3. Adopt constant temperature baking at 90 to 110 Celsius degrees for 1-2 minutes to fully evaporate internal solvents and moisture.
4. Two follow-up treatment methods are available:
First, cool finished semi-products with cooling rollers, attach release protective film, which can be sold or laminated within six months.
Second, conduct hot press lamination at 100-170℃ for one minute, then accomplish curing at 175℃ for 40 minutes or 50-60℃ for 24 hours.
5. Execute all required physical and chemical tests after 24 hours of static placement.
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