Multi Head Die Bonder Equipment For Optical Modules / HDMI USB Connectors
Price:
Negotiation
MOQ:
1set
Delivery Time:
Negotiable
Brand:
UW
Product Description
Equipment Overview
This equipment is designed for the high-precision assembly of optical modules, HDMI/USB connectors, sensors, optical devices, light source modules, and driver modules
Highlights
- High precision assembly: SP class silent linear guides with straightness within 2 μm; laser interferometer motion compensation; placement accuracy ±0.8 μm; repeatability ±0.4 μm. Supports fast, high‑precision timing of 6 pulses in 100 ms, ensuring consistent accuracy across production units and minimizing precision degradation from moving components.
- Reduced misjudgment: Independent micro‑flow air circuits per nozzle enable individual loop detection, lowering system false judgments.
- Strong compatibility: Simultaneously supports placement of optical chips and electrical chips.
- Professional support: A dedicated vision team provides customized, efficient, and accurate positioning solutions for various products.
- Customization: Upgradeable to a eutectic bonder with the addition of a eutectic module.
Specifications
| Parameter Name | Parameter Value |
| Cycle Time | 3s-12s (Depending on product) |
| Placement Accuracy | ±3 @3σ (Depending on product) |
| Angular Accuracy | ±0.5° @3σ (Depending on product) |
| Die Size | 0.15×0.15mm - 5×5mm (Lens change required based on product) |
| Die Thickness | 0.076 - 1mm (3 - 40mil, Standard). Min. 0.05mm (2mil, Optional) |
| Lead Frame Size | L: 100 - 300mm; W: 40 - 90mm (Customization required for <40mm). H: 0.1-0.8mm (Standard), 0.8-2.0mm (Optional) |
| Tray Size | Customer Provided |
| Wafer Size | Compatible with 6-8 inch wafers (2-inch, 4-inch waffle packs) |
| Auto θ Calibration | ±15° Range |
| Max Wafer Angular Correction | 360° |
| Bonding Force | 20-300g (Customizable) |
| Standard Track Width | 40-90mm (Customizable) |
| PR System | 256 Grayscale / Edge Detection |
| Resolution | 1920pixel×2560pixel (Customizable) |
| PR Accuracy | 5M (1920×2560pixel) FOV (16mm;×1,×2,×4) |
| Angular Tolerance | ±0.1 |
| Dimensions | W: 1630mm; H: 1160mm; D: 1500mm (Subject to final product) |
| Weight | 1200KG (Subject to final product) |
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Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
United Winners Laser Co., Ltd
Location
UW Building 101, Block A, No.18 Rongsha Road, Shatian Community, Kengzi Street, Pingshan District, Shenzhen
Contact Person
Shirley