Customized Automatic Die Bonder Machine For FRD IGBT Chips Resistors
Equipment Overview
The equipment is designed for the pick-and-place (P&P) of FRD, IGBT chips, resistors, and soldering tabs. It can operate as a standalone unit or be integrated into a multi-machine line for sequential processing. Target applications include automotive electronics, renewable energy, industrial controls, home appliances, and rail transportation.
Highlights
• Automatic thimble module replacement, solving the problem of large differences in chip sizes;
• Automatic wafer exchange and film expansion, compatible with 8" ~ 12" wafers;
• Customized feeding platform supporting four feeding methods: blue film, tray, feeder, and vibratory bowl; with automatic cutting and shaping of soldering tabs;
• Six sets of nozzles designed for large size differences, with automatic nozzle switching.
Technical Parameters
| Parameter Name | Parameter Values |
| Cycle Time | 4000ms (Dependent on product) |
| XY Placement Accuracy | ±10μm @ 3σ (Equipment accuracy, actual product accuracy depends on incoming materials) |
| Theta Range | ±1°@3σ |
| Force Control | 20g-300g |
| Die Size | 0.15×0.15mm-15×15mm |
| Die Thickness | Thickness: ≥70um |
| NTC | Tape & Reel, Electronic Feeder |
| Capacity | 2000-4000 pcs/h (Depending on jig matrix density) |
| Magazine | 4 inch Gel-PAK,Wafer-PAK (Customizable) |
| Wafer Size | 12-inch (Backward compatible with 10-inch, 8-inch) |
| Auto Theta Calibration | ±10° |
| Conveyor Width | 500*350mm (Customizable) |
| PR System | 256 Gray Levels |
| Resolution | 1920pixel×2560pixel (Customizable) |
| PR Accuracy | 5M(1920×2560pixel)FOV(16mm；×1,×2,×4) |
| Dimensions | 1600×1250×2000mm (L×W×H) |
| Weight | 2000kg |
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.