Dual Drive Gantry Platform Die Bonder Machine With Customized Feeding System

Price Negotiable

Price: Negotiation

MOQ: 1set

Delivery Time: Negotiable

Brand: UW

Product Description

Equipment Overview

The equipment adopts a dual-drive gantry platform and a customized feeding system. It is compatible with Gel-Pak, Wafer Pak, blister trays, and special fixtures, making it suitable for micro-assembly applications in the pump source industry.

Highlights

Multi-Component Compatibility: Simultaneously supports the placement of SAC, PBS, and PBC components.
High Placement Accuracy: Up to ±20 μm (standard configuration).
Precision Arrangement: Capable of traying/arranging COS chips and solder preforms.
Versatile Shim Handling: Supports the placement of both large and small shims.

Technical Specifications

Parameter Name	Specification
Cycle Time	1.5s (Depends on product)
XY Placement Accuracy	±20μm @ 3σ (Standard die accuracy)
Die Rotation	±0.5° @ 3σ (Depends on product)
Die Size	0.15×0.15mm - 5×5mm (Lens change required based on product)
Die Thickness	0.076 - 1mm (3 - 40mil, Standard) Min. 0.05mm (2mil, Optional)
Lead Frame Size	L: 100-300mm; W: 40-90mm (Customization required for <40mm); H: 0.1-0.8mm (Standard), 0.8 - 2.0mm (Optional)
Tray Size	(Provided by customer based on product)
Size Range	200*250mm
Alignment Standard	Center clamping, Y-direction edge alignment
Bonding Force	20-300g (Customizable)
Pick-up Method	Blister tray, Metal tray
PR System	256 Grayscale
Resolution	5472pixel × 3648pixel (Customizable)
PR Accuracy	FOV (16.4mmX10.9mm)
Angle Tolerance	±0.1°
Dimensions	W: 1240mm; H: 1550mm; D: 1800mm (Subject to final product)
Weight	1500KG (Subject to final product)