Picosecond Laser Wafer Scribing Machine To 8 Inches Size High Precision

Price Negotiable
Price: Negotiation
MOQ: 1set
Delivery Time: Negotiable
Brand: UW
Product Description

Equipment Overview

The equipment is designed for marking wafers up to 8 inches in size, as well as for scribing MARK points and characters on ITO glass.

 

Highlights

• High-Precision Recognition: Equipped with one set of high-precision alignment cameras, two sets of global recognition cameras, and one set of self-inspection camera.

• High-Precision Assembly: Features a marble base and high-precision linear motors for the drive axes.

• Superior Accuracy: Delivers high marking precision and is equipped with a self-inspection function after marking.

 

Technical Specifications

Parameter Name Parameter Value
Marble Positioning Accuracy ≤ 10μm (Factory Parallelism / Flatness / Perpendicularity / Squareness)
XY Repeatability ±0.5μm
XY Straightness 3μm (Within every 300mm range)
Laser Z-axis Repeatability ±3μm
Resolution 1920pixel×2560pixel
Vision Accuracy 1pix = 1μm (FOV within 2mm)
Laser Source Picosecond Laser
Wavelength (nm) 300nm - 600nm
Temperature Parameters Temperature range 10 - 40℃, ±0.1℃
Dimensions W: 1650mm; H: 1070mm; D: 1900mm (Subject to final product)
Weight 1800KG (Subject to final product)
Dimensions Up to 8 inches
Wafer Line width ≤ 50μm, Positioning accuracy ±0.01mm
ITO Glass Line width ≤ 50μm, Positioning accuracy ±0.01mm
Laser Output Mode Galvo Scanner / Output Head

 

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company United Winners Laser Co., Ltd
Location UW Building 101, Block A, No.18 Rongsha Road, Shatian Community, Kengzi Street, Pingshan District, Shenzhen
Contact Person Shirley

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