Equipment Introduction

This machine adopts a picosecond laser to process perovskite, light-absorbing layers or metal electrode layers. Driven by short-pulse high-peak laser, it ensures no craters at the edges while scribing on the material surface, delivering controllable and stable processing results. It can accurately position and remove the target film layers to a precise depth without damaging the TCO substrate, and the scribed grooves feature excellent flatness and consistency at the bottom.

Highlights

• Self-developed laser and optical design; scribing line width adjustable from 20-100μm, P2 crater <50nm, P3 crater <100nm.
• Modular and flexible overall design; P2/P3 integrated in one machine for easy operation.
• High-precision visual tracking and high-speed flexible mechanism transmission, dead zone <100μm achievable.
• Independently developed dust extraction, air blowing, visual positioning and focus tracking systems.
• Self-developed dual optical path system for single-station processing, enabling P2/P3 scribing.
• Gas purification system optional: realizes gas cyclic purification to remove water, oxygen and organic gases, achieving H₂O & O₂level below 1PPM.
• Sealed chamber (glove box) optional: made of stainless steel or acrylic, filled with inert gas, equipped with glove ports and gloves for operation.
• Mechanical structure composed of marble platform and high-precision linear motor, carrying optical system and process fixtures.
• Optical system: consisting of ultra-fast laser, beam expander, reflector, DOE, focusing lens and other components.

Technical Parameters