Equipment Introduction

Adopting self-developed lasers and optical path structures, this equipment is designed for scribing perovskite and edge cleaning of the perovskite layer. It first uses ultrafast laser for cutting and modification, followed by CO₂ laser for wafer separation, achieving high-quality processing with no chipping and no cracks.

Highlights

・Adopts self-developed picosecond laser for cutting and self-developed semiconductor laser for splitting, equipped with an integrated UW cutting & splitting optical output head.

・The whole machine features a modular and flexible design with simple operation.

・Equipped with an auto-focusing and alignment vision module for accurate identification and positioning.

・Extremely minimal chipping after splitting, no micro-cracks, high cutting quality and high processing efficiency.

Technical Parameters