Feature description:
1.High deposition rate, low temperature of substrate ,well adhesion ,and can achieve large area coating.

2.It can obtain more excellent density,uniformity and  adhesion for the coating film.

3.Adopted the most advanced direct current or freguenc magnetron sputtering power.
4.Equipped with latest developed planar magnetrontarget, centre rotation cylindrical target, twinstargets,etc.

5.Advanced high speed and low temperature sputtering technology.

6.Perfect combination of intelligence industry PLC controller and touch system HMI.

TECHNICAL CONFIGURATION
Chamber structure: vertical front opening,chamber material adopts SUS304 stainless steel or carbon steel.
Vacuum system: Diffusion pump or molecular pump +Roots pump +Mechanical pump + Rotaryvane pump(Cryogenic pump can be optional).
Sputtering target:central cylindrical target,flat target(optional depend on the detailproducts).
Magnetron power: direct current or intermediate frequency magnetron sputtering power can be selected.
Rotation system:frequency control,combined with revolution and rotation.
Type of film: single film ,multi flms.
Gas control: adopt SEVENSTAR gas flux controller.

APPLICATION
Suitable for coating high grade decoration film,alloy film etc.It is widely used in plastic, cell phone shell, sanitary ware,car wheel ,metal jewelry and label etc. It also can be used for sputtering plastic products,ceramics, mosaic,resign and crystal glass products .