Compact High-Precision Electron Beam Evaporation Coating Machine for Versatile Optical Coating Applications

Price Negotiable

Price: Negotiable

MOQ: 1

Delivery Time: 45-60 work days

Brand: Zhongda

Product Description

Small Electron Beam Evaporation Coating Machines

Core Technical Specifications

Parameter Category	Details
Substrate Capacity	Max size: Up to 6-inch (150mm); Compatible with 2"/4"/6" wafers/optical components; Min size: 10×10mm
Vacuum Performance	Ultimate vacuum: ≤ 1×10⁻⁶ Torr (1.3×10⁻⁴ Pa); Pumping time: minutes to 5×10⁻⁶ Torr; Leak rate: 10⁻³ Pa*L/s (He leak test)
Evaporation System	Electron beam power: 250W-10kW; Number of crucibles/pockets: 4-8; Supports rod (max φ4mm) & crucible (1-15cc) feedstock
Process Control	Substrate temperature: RT-500℃ (±1℃ precision); Rotation speed: 2-20 rpm; Film thickness monitor: QCM (0.01 nm/s resolution)
Film Quality	Uniformity: ±1%-±3%; Adhesion: Meets ASTM D3359 4B standard; Deposition rate: 0.1-10 nm/s
Compatibility	Materials: Au, Ag, Pt, W, SiO₂, TiO₂, MgF₂, YF₃, ZrO₂ (supports AR/AF/reflective films)
Physical Dimensions	Footprint: 1-3.3×3.0m; Height: 2.5-3.5m; Weight: <800kg (desktop/tabletop models)
Power Supply	Single/Three-phase: 220V/380V, 50/60Hz; Power consumption: 1.2kW-10kW

Key Advantages

Compact & Space-Saving Design

Desktop/modular structure with Korvus HEX-800 standard, ideal for laboratory/research settings
Easy integration with glove boxes for inert-atmosphere processes
Lightweight construction and tool-free module replacement reduce installation & maintenance costs

High-Precision & Reliable Coating

Electron beam focusing technology enables deposition of refractory metals (Pt, W) and dielectric materials
0.01nm/s thickness control with film uniformity ±1% (industry-leading for small-scale equipment)
Hall ion source + Ar plasma pre-cleaning enhances film adhesion (4B grade) and density
Meets optical component performance requirements (e.g., AR films with >95% transmittance)

Versatile & Flexible Process Adaptation

Supports 4-8 crucibles/pockets for multi-material co-evaporation
Quick switch between metal, oxide, and organic films (AF/AR/reflective/protective coatings)
Compatible with 2"-6" substrates (wafers, lenses, optical fibers)
Customizable fixtures (dome/knudzin/plate) for 2D/3D components

Intelligent & User-Friendly Operation

PLC + touchscreen control system with real-time process monitoring
Pre-programmed process libraries for quick setup
Energy-efficient cryopump/magnetic suspension molecular pump design reduces power consumption by 30% vs. traditional systems

Cost-Effective for R&D & Small-Batch Production

Low initial investment with high target utilization rate (>70%) and minimal material waste
Suitable for prototyping to small-batch manufacturing (up to 10,000 pieces/year)
Multi-functional integration (e-beam evaporation + sputtering optional) eliminates need for multiple devices

Core Functions

Precise Heating and Evaporation

High-energy electron beams bombard target material surfaces, heating to molten or evaporated state
Concentrated energy and high thermal efficiency enable evaporation of refractory materials (tungsten, molybdenum, titanium, SiO₂, TiO₂)
Avoids contamination of target material by heating source
Supports multi-target material switching (2-6 crucible positions) for continuous deposition of single-layer and multi-layer films

Precise Film Thickness Control

Built-in quartz crystal film thickness monitor for real-time deposition rate and thickness monitoring
Control accuracy to nanometer level (±0.1nm) for ultra-thin functional films
Programmable control system with preset deposition parameters (electron beam power, vacuum degree, deposition rate)
Automated coating ensures batch film layer consistency

High Vacuum Environment Guarantee

Mechanical pump + molecular pump vacuum unit reduces cavity to 10⁻⁴~10⁻⁶ Pa high vacuum environment
Reduces gas molecule scattering and contamination of evaporated particles
Ensures film layers have high purity, good density and strong adhesion

Small-Sized Workpiece Adaptation

Designed specifically for small workpieces with rotary workpiece table
Improves coating layer uniformity across substrates
Suitable for substrates ranging from millimeters to tens of millimeters (wafers, optical lenses, chips, sensor components)
Supports coating of surface mount, sheet, and small parts