0.5oz-15oz OSP Wireless Charger PCBA Through Hole Soldering PCB Board Assembly

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Product Description

Intelligent Electronic Large Size Components Through-hole Assembly

♦ What is Through-Hole Assembly?

Through-Hole Assembly is the traditional way of installing electronic components: the component pins are inserted into the pre-drilled holes in the PCB and then fixed by soldering to achieve electrical connection.

♦ Features of Through-Hole Assembly?

- Component Leads: Components have long, sturdy leads that pass through holes in the PCB.
- Soldering: Leads are soldered to conductive pads on the opposite side (wave soldering or hand soldering).
- Mechanical Strength: Provides strong physical bonds, making it ideal for high-stress environments.
- Reliability: Better thermal and mechanical durability than SMT in some applications.
- Larger Components: Often used for bulky parts like connectors, transformers, and electrolytic capacitors.

♦ Technical Parameters

PCB Assembly Capability
Item				Normal	Special
SMT Assembly	PCB(used for SMT) specification	Length and Width( L* W)	Minimum	L≥3mm, W≥3mm	L＜2mm
		Length and Width( L* W)	Maximum	L≤800mm, W≤460mm	L ＞ 1200mm, W＞500mm
		Thickness( T)	Thinnest	0.2mm	T＜0.1mm
		Thickness( T)	Thickest	4 mm	T＞4.5mm
	SMT components specification	Outline Dimension	Min size	0201(0.6mm*0.3mm)	01005(0.3mm*0.2mm)
			Max size	200 * 125	200 * 125
			component thickness	T≤15mm	6.5mm＜T≤15mm
		QFP,SOP,SOJ (multi pins)	Min pin space	0.4mm	0.3mm≤Pitch＜0.4mm
		CSP/ BGA	Min ball space	0.5mm	0.3mm≤Pitch＜0.5mm
DIP Assembly	PCB specification	Length and Width( L* W)	Minimum	L≥50mm, W≥30mm	L＜50mm
		Length and Width( L* W)	Maximum	L≤1200mm, W≤450mm	L≥1200mm, W≥500mm
		Thickness( T)	Thinnest	0.8mm	T＜0.8mm
		Thickness( T)	Thickest	3.5mm	T＞2mm