2OZ ENIG High Tg PCB Printed Circuit Board Production For Wireless Communication
High Tg PCB High Frequency and High Speed Transmission for Wireless Communication Equipment
♦ What's High-Tg?
Tg refers to the glass transition temperature. When the substrate is exposed to high temperatures, it will change from a glass state to a rubber state. High Tg PCB refers to a circuit board that can withstand higher temperatures without deforming or turning into rubber. Materials with a glass transition temperature above 170°C are usually classified as high Tg PCBs, those above 150°C are mid-range Tg PCBs, and those above 130°C are low Tg PCBs.
♦ Features of High-Tg PCB?
-
- Good heat resistance: The Tg value of ordinary PCB is generally 130-140°C, and the actual operating temperature may be lower than 100°C due to the influence of thermal expansion coefficient; while the Tg value of high Tg PCB exceeds 170°C, and the thermal expansion coefficient is between 5 ppm/°C and 8 ppm/°C, which can operate at higher temperatures and is less affected by heat.
- High mechanical strength: It can withstand greater external forces and stresses, maintain structural stability in complex environments, and reduce the risk of damage.
- Strong chemical stability: It has higher tolerance to chemical substances and can maintain stable performance in harsh chemical environments.
- Good signal integrity: In high-frequency applications, it can provide better signal transmission and reduce signal loss and distortion.
♦ Application fields of High-Tg PCB
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- Aerospace field: used in avionics, satellite communications, flight control systems, etc., adapting to harsh conditions such as extreme temperature and high radiation, and ensuring the high reliability of aerospace equipment.
- Medical equipment field: used in CT machines, MRIs, monitors and other equipment, withstanding high temperature and high pressure environments, ensuring the accuracy and safety of medical electronic equipment.
- New energy field: used in photovoltaic inverters, wind power converters, etc., withstanding high temperature and high current, improving energy conversion efficiency, and extending equipment life.
♦ Technical Parameters
|
Item |
Specification |
|
Laers |
1~32 |
|
Board thickness |
0.1mm-7.0mm |
|
Material |
FR-4,CEM-1/CEM-3,PI,High Tg,Rogers |
|
Max panel size |
32"×48"(800mm×1200mm) |
|
Min hole size |
0.075mm |
|
Min line width |
3mil(0.075mm) |
|
Surface finish |
OSP,HASL,Imm Gold/Nickel/Ag, Electric gold |
|
Copper thickness |
0.5-7.0OZ |
|
Soldermask |
Green/Yellow/Black/White/Red/Blue |
|
Silkscreen |
Red/Yellow/Black/White |
|
Min PAD |
5mil(0.13mm) |
|
Inter package |
Vacuum |
|
Outer package |
Carton |
|
Outline tolerance |
±0.75mm |
|
Hole tolerance |
PTH:±0.05 NPTH:±0.025 |
|
Certificate |
UL,ISO 9001,ISO14001,IATF16949 |
|
Special request |
Blind hole+Gold finger + BGA |
|
Material Suppilers |
Shengyi, KB, Nanya, ITEQ,etc. |
Get in Touch
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