ENIG SMT Electronic PCB Automotive Flex Circuit Assemblies For Body Control Modules
Wide Operating Temperature and High Reliability Automotive PCBA for Body Control Modules
♦ What's Automotive PCBA?
Automotive PCBA, is the core of automotive electronic systems.It fixes the electronic components on the PCB to form a complete circuit, which is used in various systems of the car.
♦ Features of Body Control Module PCBA
- Multi-function Control: Controls various body functions, such as lighting (including automatic headlights, turn signals, and interior lighting), window lifting (electric windows), door locking and unlocking (central locking system), air conditioning system regulation, wiper control (including intermittent wiper control), and seat control.
- Communication Capability: Communicates with other ECUs in the vehicle through protocols like CAN, LIN, or FlexRay to coordinate and control different systems.
- Power Management: Optimizes the working mode of electrical components to reduce power consumption when components are not in use, improving fuel efficiency in traditional vehicles and extending the range of electric vehicles.
- Diagnostics and Fault Reporting: Stores diagnostic data to help identify problems in the electrical system and assist maintenance personnel in troubleshooting.
♦ Types of Automotive PCB Assemblies:
| Application | PCB Requirements | Examples |
|---|---|---|
| Engine Control Unit (ECU) | High-temperature resistance, EMI shielding | Fuel injection, ignition timing |
| Infotainment System | High-speed signal integrity, multilayer | Touchscreens, GPS, Bluetooth |
| ADAS (Radar/LiDAR) | RF/microwave PCBs, low-loss materials | Collision avoidance, adaptive cruise control |
| EV Battery Management (BMS) | High-current PCBs, thermal management | Cell balancing, charge monitoring |
| LED Lighting | Aluminum PCBs for heat dissipation | Headlights, interior lightin |
♦ DQS's PCB Assembly Capability
|
Item |
Normal |
Special |
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|
SMT Assembly |
PCB(used for SMT) specification |
Length and Width( L* W) |
Minimum |
L≥3mm, W≥3mm |
L＜2mm |
|
Maximum |
L≤800mm, W≤460mm |
L ＞ 1200mm, W＞500mm |
|||
|
Thickness( T) |
Thinnest |
0.2mm |
T＜0.1mm |
||
|
Thickest |
4 mm |
T＞4.5mm |
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|
SMT components specification |
Outline Dimension |
Min size |
0201(0.6mm*0.3mm) |
01005(0.3mm*0.2mm) |
|
|
Max size |
200 * 125 |
200 * 125 |
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|
component thickness |
T≤15mm |
6.5mm＜T≤15mm |
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|
QFP,SOP,SOJ (multi pins) |
Min pin space |
0.4mm |
0.3mm≤Pitch＜0.4mm |
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|
CSP/ BGA |
Min ball space |
0.5mm |
0.3mm≤Pitch＜0.5mm |
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|
DIP Assembly |
PCB specification |
Length and Width( L* W) |
Minimum |
L≥50mm, W≥30mm |
L＜50mm |
|
Maximum |
L≤1200mm, W≤450mm |
L≥1200mm, W≥500mm |
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|
Thickness( T) |
Thinnest |
0.8mm |
T＜0.8mm |
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|
Thickest |
3.5mm |
T＞2mm |
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