0.8mm 10 Layer Ultra Thin Flexible Pcb Assembly ENIG Surface
Flexible PCB High Temperature Resistance Vibration Resistance for Automobile Engine Control
♦ What is Flexible PCB
Flexible PCB (FPC), also called a "soft board" or flexible circuit, is a type of printed circuit board (PCB) made from flexible insulating materials, such as polyimide (PI) or polyester (PET), instead of rigid fiberglass (FR4). This unique construction allows FPCs to bend, fold, and twist without breaking, enabling compact, lightweight, and space-saving designs in modern electronics.
♦ Features of Flexible PCB
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- Bendable and foldable: The base material is a flexible plastic (such as polyimide), which can be bent and rolled at will to adapt to complex space designs (such as folding mobile phone screens).
- Thin and space-saving: Thinner and lighter than traditional hard boards (thickness is about 0.05-0.3mm), suitable for small devices such as mobile phones and headphones.
- Reduce the number of parts: Directly replace traditional cables and connectors, simplify assembly, and reduce costs.
- Durable and vibration-resistant: There are no hard connection points, good shock resistance, suitable for moving equipment such as cars and robots.
♦ Difficulties in FPC Manufacturing
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- Delicate substrate: thin and soft, easy to wrinkle and crack during processing.
- Ultra-fine lines: micron-level line width, easy to break or connect incorrectly.
- Difficult alignment: multiple layers are easily misaligned.
- Difficult surface treatment: both bendable and conductive.
- Troublesome detection: internal problems are difficult to find, and detection is expensive and time-consuming.
♦ Applications of Flexible PCB
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Smartphones & Wearables (foldable screens, flexible displays);
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Laptops & Tablets (hinge connections, battery flex cables);
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Automotive Electronics (sensors, lighting, dashboard controls);
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Medical Devices (implantable electronics, diagnostic equipment);
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Aerospace & Defense (lightweight, high-reliability circuits).
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♦ Technical Parameters
|
Item |
Spec |
|
Layers |
1~64 |
|
Board Thickness |
0.1mm-10 mm |
|
Material |
FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc |
|
Max Panel Size |
800mm×1200mm |
|
Min Hole Size |
0.075mm |
|
Min Line Width/Space |
Standard: 3mil(0.075mm) Advance: 2mil |
|
Board Outline Tolerance |
士0.10mm |
|
Insulation Layer Thickness |
0.075mm--5.00mm |
|
Out Layer Copper Thickness |
18um--350um |
|
Drilling Hole (Mechanical) |
17um--175um |
|
Finish Hole (Mechanical) |
17um--175um |
|
Diameter Tolerance (Mechanical) |
0.05mm |
|
Registration (Mechanical) |
0.075mm |
|
Aspect Ratio |
17:01 |
|
Solder Mask Type |
LPI |
|
SMT Min. Solder Mask Width |
0.075mm |
|
Min. Solder Mask Clearance |
0.05mm |
|
Plug Hole Diameter |
0.25mm--0.60mm |
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