16 Layer Immersion Gold HDI  PCB for Electronic Product

♦ What is Immersion Gold?

​​Immersion Gold​​ (also known as ​​ENIG – Electroless Nickel Immersion Gold​​) is a ​​surface finish​​ applied to ​​printed circuit boards (PCBs)​​ to protect exposed copper pads and ensure reliable solder connections. It consists of two layers:

1. 1. ​​Electroless Nickel (Ni)​​ – A thin (3–6µm) nickel-phosphorus layer deposited chemically (without electricity) to act as a barrier, preventing copper diffusion.
   2. ​​Immersion Gold (Au)​​ – A very thin (0.05–0.1µm) gold layer plated over the nickel to prevent oxidation and enhance solderability.

♦ ​​Key Characteristics of Immersion Gold (ENIG):

✔ ​​Flat Surface​​ – Ideal for fine-pitch components (e.g., BGAs, QFNs).
✔ ​​Excellent Solderability​​ – Ensures strong, reliable solder joints.
✔ ​​Long Shelf Life​​ – Resists oxidation better than bare copper or OSP.
✔ ​​Wire-Bondable​​ – Suitable for gold or aluminum wire bonding (used in IC packaging).
✔ ​​Lead-Free & RoHS Compliant​​ – Environmentally friendly compared to HASL (lead-based).

♦ Comparison with Other PCB Finishes?​

♦ Technical Parameters

♦ One-Stop PCBs Solution

 

PCB Prototype	Felx PCB	Rigid-Flex PCB	Ceramic PCB
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♦ Advantages of DQS Team

1. On-time Delivery:  

• • Owned PCBA factories 15,000 ㎡
  • 13 fully automatic SMT lines 
  • 4 DIP assembly lines

 

     2. Quality Guaranteed:

• • IATF, ISO, IPC, UL standards 
  • Online SPI, AOI, X-Ray Inspection 
  • The qualified rate of products reach 99.9%

 

     3. Premium Service:

• • 24H reply your inquiry
  • Perfect after-sales service system
  • From prototype to mass production