OEM EV Charger Automotive PCB Assembly GPS Tracker PCBA

Price Negotiable

Price: Contact our PCB engineer

MOQ: 1

Delivery Time: Negotiable

Product Description

OEM EV Charger Automotive PCB Assembly GPS Tracker PCBA

What is EV Charger PCB?

An EV Charger PCB is the specialized printed circuit board at the heart of every electric-vehicle charger. It is a multi-layer board that mounts and interconnects all the active and passive components required to draw energy from the grid, convert it to the correct voltage/current profile, and deliver it safely to the vehicle's battery.

Key functional blocks you will find on a typical EV-charger PCB:

Power section - PFC stages, AC/DC or DC/DC converters, thick-copper traces or bus-bars for 30 A-200 A, high-voltage MOSFETs/IGBTs, SiC/GaN devices, bulk capacitors, current-sense shunts or Hall sensors.
Control section - micro-controller or DSP that runs the charging algorithm, gate drivers, voltage/current feedback loops, ADCs, DACs.
Safety & protection - relays/contactors, fuses, MOV/RCD, ground-fault detector, isolation amplifiers, temperature sensors, watchdogs.
Communication - PLC or CAN transceiver for vehicle "hand-shake", Ethernet/Wi-Fi/4G modem for OCPP back-office, RFID or NFC front-end for user authentication.
Auxiliary power - off-line SMPS (often 5 W-50 W) that generates the low-voltage rails (3.3 V, 5 V, ±12 V, 24 V) for logic and contactors.

Types of Automotive PCB Assemblies:

Application	PCB Requirements	Examples
Engine Control Unit (ECU)	High-temperature resistance, EMI shielding	Fuel injection, ignition timing
Infotainment System	High-speed signal integrity, multilayer	Touchscreens, GPS, Bluetooth
ADAS (Radar/LiDAR)	RF/microwave PCBs, low-loss materials	Collision avoidance, adaptive cruise control
EV Battery Management (BMS)	High-current PCBs, thermal management	Cell balancing, charge monitoring
LED Lighting	Aluminum PCBs for heat dissipation	Headlights, interior lighting

DQS's PCB Assembly Capability

Item	Normal	Special
SMT Assembly	PCB(used for SMT) specification
	Length and Width( L* W)
	Minimum: L≥3mm, W≥3mm	L＜2mm
	Maximum: L≤800mm, W≤460mm	L＞1200mm, W＞500mm
	Thickness( T)
	Thinnest: 0.2mm	T＜0.1mm
	Thickest: 4 mm	T＞4.5mm
SMT components specification
Outline Dimension
Min size: 0201(0.6mm*0.3mm)	01005(0.3mm*0.2mm)
Max size: 200 * 125	200 * 125
component thickness	T≤15mm	6.5mm＜T≤15mm
QFP,SOP,SOJ (multi pins)	Min pin space: 0.4mm	0.3mm≤Pitch＜0.4mm
CSP/ BGA	Min ball space: 0.5mm	0.3mm≤Pitch＜0.5mm
DIP Assembly
PCB specification
Length and Width( L* W)
Minimum: L≥50mm, W≥30mm	L＜50mm
Maximum: L≤1200mm, W≤450mm	L≥1200mm, W≥500mm
Thickness( T)
Thinnest: 0.8mm	T＜0.8mm
Thickest: 3.5mm	T＞2mm