4 Layer(2 Layer FPC +1 Layer Rigid PCB +1 Layer FPC) Board for Radar
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Product Description
4 Layer (2 Layer FPC + 1 Layer Rigid PCB + 1 Layer FPC) Board for Radar
This specialized rigid-flex PCB combines flexible and rigid substrates to create a high-performance circuit board specifically designed for radar applications, offering exceptional reliability in demanding environments.
What is Rigid-Flex PCB?
Rigid-Flex PCB is a composite structure circuit board that combines rigid printed circuit board (PCB) and flexible circuit board (FPC) technologies. It consists of two main components: rigid sections made from traditional PCB materials like FR-4 that provide stable electrical performance and mechanical strength, and flexible sections made from polyimide or polyester materials that offer high bending and folding resistance. These components are connected through specialized adhesives or welding processes to create a unified, reliable circuit assembly.
Features of Rigid-Flex PCB
- Rigid-Flexible Combination: Rigid sections support core components while flexible sections enable bending
- Space Saving Design: Replaces traditional cables and reduces device size for thin, lightweight applications
- High Bending Resistance: Flexible sections withstand millions of bending cycles with extended lifespan
- Signal Stability: Rigid sections ensure high-speed signal transmission with minimal interference
- Enhanced Reliability: Excellent vibration resistance, high temperature tolerance, and adaptability to complex environments
- Simplified Assembly: Integrated design reduces welding points and lowers overall manufacturing costs
Applications of Rigid-Flex PCB
- Consumer Electronics: Smartphones, tablets, smart watches, digital cameras, and portable devices for space optimization and foldable designs
- Medical Equipment: Pacemakers, medical imaging systems, portable instruments, and implantable devices requiring flexible connections in complex environments
- Aerospace & Radar Systems: Aircraft instrument panels, navigation systems, communication equipment, and radar systems demanding lightweight, high reliability, and extreme environment resistance
Technical Parameters
| Item | Specification |
|---|---|
| Layers | 1~64 |
| Board Thickness | 0.1mm-10mm |
| Material | FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, Ceramic, etc |
| Max Panel Size | 800mm×1200mm |
| Min Hole Size | 0.075mm |
| Min Line Width/Space | Standard: 3mil(0.075mm) Advance: 2mil |
| Board Outline Tolerance | ±0.10mm |
| Insulation Layer Thickness | 0.075mm--5.00mm |
| Out Layer Copper Thickness | 18um--350um |
| Drilling Hole (Mechanical) | 17um--175um |
| Finish Hole (Mechanical) | 17um--175um |
| Diameter Tolerance (Mechanical) | 0.05mm |
| Registration (Mechanical) | 0.075mm |
| Aspect Ratio | 17:01 |
| Solder Mask Type | LPI |
| SMT Min. Solder Mask Width | 0.075mm |
| Min. Solder Mask Clearance | 0.05mm |
| Plug Hole Diameter | 0.25mm--0.60mm |
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Advantages of DQS Team
On-time Delivery
- 15,000 ㎡ owned PCBA factories
- 13 fully automatic SMT production lines
- 4 dedicated DIP assembly lines
Quality Guaranteed
- IATF, ISO, IPC, UL certified standards
- Comprehensive online SPI, AOI, and X-Ray inspection systems
- 99.9% product qualification rate
Premium Service
- 24-hour response to customer inquiries
- Comprehensive after-sales service system
- Complete support from prototype development to mass production
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Company
DQS Electronic Co., Limited
Location
Yasen Industrial Park, Baolong Street, Longgang District, Shenzhen
Contact Person
Jason Guan