Dual Valve Vision Dispensing Machine FPC Modules Underfill Coating Sealant
Dual-Valve Vision Dispensing Machine for Underfill & Coating in FPC Modules
In the consumer electronics industry, FPC modules require extremely precise and stable dispensing processes for Underfill (bottom filling) and Conformal Coating. The Mingseal FS600DD Series Dual-Head Vision Inline Dispensing Machine is specially designed for high-efficiency, high-yield mass production and is widely used in MiniLED packaging, LED modules, FPC reinforcement, and protective coating — all of which are key processes in consumer electronics manufacturing.
This equipment has been successfully deployed in Southeast Asian markets such as Malaysia, India, and South Korea, helping local factories significantly improve production line throughput and product yield.
Key Advantages
● Dual-head dual-valve parallel dispensing — Flexible switch between synchronous or independent operation modes
● ±10μm repeatability — Guarantees precise dispensing positions for Underfill and Coating, greatly improving finished product yield.
● 0.1mg high-precision weighing — Real-time monitoring of dispensing weight eliminates overflow or missing glue issues and supports various high- or low-viscosity adhesives.
● Compact structure for dense panel loading — Small footprint, auto-adjustable track height and width, ideal for high-density shadow board applications.
● Supports dual-track and bottom heating — Ensures stable fluidity and curing conditions for multiple processes like Underfill, Coating, and PCB Assembly.
Technical Specifications
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FS600DDF Visual Inline Dispensing Machine |
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Occupied Area |
Dimensions (W*D*H) |
770*1200*2000mm |
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Clearness Level |
Clearness of workspace |
Class 1000 |
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Motion System |
Dispensing Range (W*D) |
320*400mm (Dual-valve) |
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Repeatability (3sigma) |
X1/X2/YY1: ±10μm |
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Positioning Accuracy (3sigma) |
X1/X2/Y/Y1: ±15μm Z1/Z2: ±10μm |
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Max. Speed |
X1/X2/Y/Y1: 1300mm/s |
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Max. Acceleration |
X1/X2/Y/Y1: 1.3g Z1/Z2: 0.5g |
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Transmission Track |
Number of Tracks |
Single / Double track (Optional) |
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Width Adjustment Method |
Auto width adjustment |
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Width Adjustment Range |
50~450mm |
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Max. Convey Speed |
300mm/s |
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Max. Carrier Plate Thickness |
10mm |
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Loadable Board Size (Bottom-mounted) |
10mm |
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Loadable Board Size (Top-mounted) |
10mm |
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Visual System |
Camera Pixels |
130W |
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Recognition Accuracy |
Pixel resolution ≤ 8 μm/pixel |
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Light Source |
Circular combination+Coaxial red light (Optional) |
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Weighing System |
Accuracy |
0.1/0.01mg (Optional) |
Q1: What FPC module processes is the FS600 Series suitable for?
A: Ideal for COF/COB chip Underfill, camera module flex Underfill, protective coating, local reinforcement, and sealing applications.
Q2: What advantages does the dual-head dual-valve design have over single-head?
A: Dual heads can work synchronously or independently, supporting different adhesives and valves simultaneously, greatly boosting UPH and process flexibility.
Q3: How does the machine ensure dispensing consistency?
A: High-resolution vision system + real-time weighing + closed-loop control ensures each glue point is uniform and accurate.
Q4: Can it integrate with existing SMT lines?
A: Yes — dual-track option, auto width adjustment, and SMEMA interface make it easy to connect with existing SMT production lines.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.