Product overview

This inline hot melt glue dispenser is built for SMT and PCBA processes including underfill, adhesive dotting and monitoring . It combines precise temperature control for heated syringe cartridges or heated lines, fast‑response dispensing valves (piezo/VCM options), a precision gantry motion system, optional 2D/3D vision alignment and MES connectivity for recipe control and traceability. Designed for inline integration, the system supports continuous production and quick recipe changeover.

Problem → Cause → Solution

Problem: In SMT lines, inconsistent glue volume, stringing or misplacement cause rework, solder defects and lower yield.
Cause: Variations in adhesive temperature/viscosity, slow valve response, poor nozzle selection and lack of inline verification create deposit variability.
Solution: Use a closed‑loop hot melt dispenser with syringe cartridge, fast valve actuation, optimized nozzle selection and vision feedback. Validate and lock recipes for each substrate to ensure repeatable production.

Key specifications

Applications

• Underfill dispensing on SMT/PCBA for BGA and small modules.
• Adhesive dotting and monitoring before reflow/solder.
• Inline sealing and gasketing for connectors, sensors and compact modules.

How it works

1. Material prep: load hot melt into heated reservoir or syringe; enable temperature control.
2. Recipe & alignment: load recipe from operator or MES; vision aligns part fiducials.
3. Dispensing action: valve issues pulses or continuous feed while gantry follows programmed path.
4. Verify & log: vision/AOI inspects bead shape and position; process data saved for traceability.

How to choose

• Throughput vs precision: choose larger reservoir and higher heating power for continuous high throughput; piezo valve + vision for micro‑dots and minimal stringing.
• Adhesive compatibility: check viscosity‑temperature curve; use syringe heated sleeve for small batches or heated reservoir for continuous runs.
• Nozzle selection: mushroom/taper/slit per bead geometry; run pilot tests to confirm profile.
• Integration: verify MES/PLC protocols and I/O mapping (recipe push/pull, start/stop signals).

FAQ

Q: Which hot melt adhesives are supported?
A: Supports common hot melt adhesives (EVA and similar). For filled adhesives, validate viscosity/temperature profile and use heated reservoir plus appropriate nozzle.
Q: How can stringing be reduced?
A: Use fast valve response (piezo/VCM), optimized pulse width, correct nozzle‑to‑part distance and inline vision feedback to minimize stringing.
Q: Does the system store recipes and integrate with MES?
A: Yes—recipe storage and MES recipe push/pull are supported via standard industrial protocols.