Large Format Adhesive Dispensing Machine — Inline Visual Dispensing System for SMT Industry
Product overview
This large format adhesive dispensing machine is designed for SMT production lines handling large boards and display modules. The platform integrates a heavy‑duty gantry, multi‑nozzle dispense heads, integrated 2D/3D vision alignment, or quick disassembly options, AOI for inline verification, and MES interfaces. It supports synchronized/asynchronized valve dispense modes for high UPH.
Problem → Cause → Solution
Problem: Large panels commonly show inconsistent dispensing and placement drift across board width, causing functional defects.
Cause: Insufficient motion stability, poor registration on large surfaces, adhesive temperature/viscosity variation and low single‑head throughput lead to variability.
Solution: A large format gantry with multi‑nozzle banks, vision‑guided fly-alignment and temperature‑controlled dispensing stabilizes deposit volume and position; validated recipes and AOI ensure repeatable production.
Technical Specifications
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Structure |
Floor-mounted gantry (marble frame + mobile gantry ) |
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Dimensions (W × D × H) |
1360 × 1280 × 1550 mm |
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Dispensing range ( W × D) ( Single valve vertical dispensing) |
900 × 600 mm |
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Max. speed |
X/ Y:1300 mm/ s Z: 500 mm/ s |
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Max. acceleration |
X/ Y:1.3 g Z: 0.5 g |
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Repeatability (3 sigma) |
X/ Y: ± 0.015 mm Z: ± 0.005 mm |
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Positioning accuracy (3 sigma) |
X/ Y: ± 0.03 mm Z: ± 0.01 mm |
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Track width adjustment method |
Automatic width adjustment |
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Track width adjustment range |
150 ~ 500 mm |
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Conveyor belt load |
5kg |
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Max. substrate thickness |
0.5 ~ 10 mm |
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Max. height of devices on top of PCB |
25 mm |
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Max. height of devices on bottom of PCB |
25 mm |
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Conveyor track |
Stainless steel chains |
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Camera pixels (optional) |
130 W black & white (Optional) |
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Light source |
RGB colored light source (Optional) |
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Input voltage |
220 VAC 50 ± Hz |
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Power |
3.5 KW |
Applications
- Large SMT panel underfill, bead sealing and component fixation for displays and lighting modules.
- Gasket/perimeter sealing and thermal pad placement on large boards.
- High UPH production with parallel dispensing across wide panels.
How to choose
- Panel footprint: choose working width matching your maximum panel dimensions and fixture layout.
- Throughput vs precision: use multi‑nozzle banks and parallel dispense for UPH; choose piezo/VCM valves and vision alignment for micro‑dots.
- Adhesive compatibility: for filled/high‑viscosity adhesives prefer piston/peristaltic pumps and heated feed lines; for low‑viscosity fluids pressure/time or micro‑valve may suffice.
- Integration & traceability: enable MES/OPC‑UA when recipe push/pull and SPC logging are required.
FAQ
Q: What is the minimum deposit size achievable?
A: Typical minimum volume ≥0.01 μL depending on nozzle and adhesive viscosity—confirm with sample validation.
Q: Can the system handle filled adhesives?
A: Yes—use piston/peristaltic pump options with heated feed lines for filled or thixotropic adhesives; validate in pilot tests.
Q: Does the machine support MES recipe management?
A: Yes—supports recipe push/pull and batch logging via standard industrial protocols (EtherNet/IP / OPC‑UA / RS‑485).
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.