Product introduction

The FS800F15 is equipped with a single valve configuration offering a maximum dispensing range of 1700mm on a dual-track system, enabling efficient inline processing of large flexible boards or multiple smaller panels simultaneously. The machine is optimized for demanding applications that require high glue control accuracy — especially for NTC thermistors where adhesive quantity and flatness are critical for precise temperature reading, or strip bonding, where uniform glue thickness, no air bubbles, and strong adhesion directly affect battery safety and signal integrity.

Problem → Cause → Solution

Problem: FPC assembly for new‑energy modules requires consistent adhesive volume and placement to ensure electrical and thermal reliability.
Cause: Manual dosing, temperature drift and uncontrolled actuation timing lead to variable deposits and inconsistent bonding.
Solution: The machine maintains precise feed temperature, uses controlled dispensing heads and camera registration to place adhesive reliably; validated recipes reproduce results across shifts.

Technical Specifications

Applications

• Adhesive dotting and dispensing application for FPC interconnects in battery management and sensor assemblies.
• Local sealing and fixation for flexible modules used in new‑energy equipment.
• Pilot production and R&D transfer where temperature‑sensitive adhesives are used.

How it operates

1. Load material: install cartridge or connect heated feed; set target temperature.
2. Register part: camera locates reference marks and adjusts coordinates.
3. Dispense: gantry positions the head and applies deposits per recipe.
4. Inspect & log: camera checks deposit shape; recipe and run data saved for traceability.

How to select the right configuration

• For filled or high‑viscosity adhesives choose heated feed and larger nozzle sizes.
• For very small deposits confirm minimum volume and actuation timing with a sample test.
• For higher throughput add a second dispensing head or use parallel head operation; request a measured cycle time for your pattern.

Installation & maintenance

Installation: bench or inline mounting; connect power, compressed air (if required) and network; follow grounding and ESD rules.
Commissioning: run material × nozzle × temperature × motion tests to create validated recipes and inspection criteria.
Maintenance: clean nozzles daily under heavy use; replace seals and tips as scheduled; calibrate camera monthly.

FAQ

Q: Which adhesives are compatible?
A: Hot‑melt adhesives commonly used in FPC assembly (confirm viscosity‑temperature curve and run a sample validation for filled systems).
Q: How small a deposit can the machine make?
A: Minimum volume typically ≥0.01 μL depending on nozzle and adhesive; confirm with a sample test.
Q: Can the system be integrated into my line?
A: Yes — supports standard digital I/O and optional communication protocols for factory integration.