High-precision Jetting Valve with 500,000cps Viscosity and 3.55 KG Controller for Miniature Speaker Assembly
Price:
$4500-$10000 / pcs
MOQ:
1
Delivery Time:
7-60days
Brand:
Mingseal
Product Description
TWS Phones Speaker Assembly Jetting Valve Piezoelectric Valve 1.2KHz
Low maintenance cost Jetting valves in Miniature Speaker Assembly of TWS/Phones
The KPS2000 Piezo Jet Valve is a high-performance dispensing solution specifically engineered for the rigorous demands of micro-speaker assembly in TWS earbuds, smartphones, and wearables. By leveraging advanced piezoelectric technology, it delivers ultra-precise, non-contact dispensing of adhesives—such as UV, epoxy, and cyanoacrylate—eliminating the risk of mechanical damage to delicate membranes and voice coils.
With a maximum frequency of 1200Hz, the KPS2000 significantly boosts UPH (Units Per Hour) while maintaining nanoliter-level dot consistency. Designed for the global electronics supply chain, it is the preferred choice for top-tier manufacturers in China, Korea, and Vietnam looking to optimize their automated production lines.
Core Advantages
- Non-contact high-frequency dispensing: Suitable for small structural components, avoiding contact that may cause deviation or damage to the membrane and coil
- Precise control of micro-glue volume: Nanoliter dispensing capability to ensure dispensing consistency and batch yield
- Quick response, precise positioning
- Quick-detachable flow channel + ADJ top calibration function: Simplify disassembly and cleaning steps
Main Application
- TWS earphone speaker module bonding (housing + FPC + membrane)
- Smart watch sound cavity dispensing packaging
- Mobile phone earpiece speaker module voice coil support bonding
Technical Parameters
KPS2000 piezoelectric valve
| Pressure supply range | 0.1～8 Bar |
| Viscosity range | Medium or high viscosity up to 500000mpas |
| Max jetting frequency | 1200Hz |
| Work temperature range | 10～50°C |
| Corrosion resistance | All aqueous media, organic solvents, weak acids, and weak bases |
| Size | 125.5*40*20mm (No runner assembly included) 125.5*75*20mm (Includes runner assembly) |
| Weight | 430g (With fluid box, no cables) |
KPC2000 controller
| AC power input | AC 220V±20% |
| Jetting frequency | 1~1200HZ |
| Settings display | TFT color screen |
| Reserved interface | Supports RS232/RS485 |
| Weight | 3.55KG |
| Size | 232*170*165 mm |
| Power | 275W |
FAQ
Q1: How does the KPS2000 piezo jet valve ensure high dispensing consistency in micro speaker applications?
A1: The KPS2000 features a coaxial needle guidance structure and micron-level adjustment mechanism, ensuring stable, repeatable adhesive dots with no satellite droplets. This is especially important for diaphragm and voice coil bonding, where precision directly affects acoustic performance.
Q2: Can the KPS2000 adapt to different adhesive types used in speaker production?
A2: Yes, the KPS2000 supports a wide range of adhesives including epoxy, UV-curable, silicone, and thermal cure adhesives. Its adjustable jetting parameters allow quick adaptation to different viscosities and curing requirements commonly used in speaker assembly.
Q3: What is the typical maintenance or cleaning process for the KPS2000 in mass production?
A3: Thanks to its quick-release flow path module, the KPS2000 can be disassembled, cleaned, and reassembled in under 2 minutes, without the need for recalibration. This minimizes downtime and keeps production efficiency high.
Q4: How does the supplier support process validation and integration for new speaker projects?
A4: We provide full application support, including sample testing, parameter optimization, and onsite/remote commissioning. Our engineers work closely with customers to ensure smooth line integration and stable dispensing results from NPI to mass production.
Q5: What markets are currently using the KPS2000 for micro speaker production?
A5: The KPS2000 is widely adopted by top speaker module manufacturers in China, Vietnam, and Korea, especially for TWS earbuds, smartphones, and wearables, where precision, repeatability, and production speed are critical.
About Mingseal
Founded in 2008, Changzhou Mingseal Robot Technology Co., Ltd. is a technology-driven manufacturer of high-end equipment, specializing in connection, assembly, inspection systems, and key components for advanced semiconductor packaging and precision electronics. Our solutions are widely adopted by leading customers in sectors such as semiconductor packaging, consumer electronics, and automotive electronics. With a strong presence across Asia and the Americas, we deliver reliable support and innovation globally.
Partner with Mingseal to power the future of automatic manufacturing!
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Company
Changzhou Mingseal Robot Technology Co., Ltd.
Location
Mingseal Intelligent Manufacturing Center Building, No. 18-98 Middle changwu Road, wujin District, Changzhou,Jiangsu, China
Contact Person
Sun