High Viscosity 1~500,000 cps Piezo Jetting Valve with 0.5nl Minimum Glue Spraying Amount for PCBA FPC Dispensing
Piezo jet valves are increasingly used in PCBA production for precise, non-contact solder paste dispensing. These valves can handle specially formulated jettable solder pastes with particle sizes and viscosities up to 80,000 cps. With nanoliter-level control and jetting frequencies up to 500Hz, piezo valves deliver uniform dot sizes without contact, reducing the risk of pad damage or bridging on dense PCBs.
The non-contact design allows solder paste to be applied to hard-to-reach areas, curved surfaces, or over uneven substrates, supporting advanced packaging and high-density SMT boards. Mingseal's high-precision piezo jet valve systems also feature anti-clogging structures and easy maintenance, ensuring long-term reliability on high-throughput production lines.
- Non-contact Jetting
- Micro-volume Precision
- High-viscosity Compatible
- High-frequency Jetting
- Easy Valve Clean Process
- Automation Friendly
- Low maintenance cost
- FPC board
- PCB board
- Mini LED
- FoPLP
- Type 5
- Type 6
- Type 7
| KPS2000-KX Solder Paste Dispense Valves | |
|---|---|
| Viscosity | 80,000cps |
| Max jetting frequency | 500Hz |
| Solder paste types | Type 5, Type 6, Type 7 |
| Valve Size | 125.5*40*20mm (No runner assembly included) 125.5*75*20mm (Includes runner assembly) |
| Valve Weight | 430g (With fluid box, no cables) |
| KPC2000 Controller | |
|---|---|
| AC power input | AC 220V±20% |
| Jetting frequency | 1~1200HZ |
| Settings display | TFT color screen |
| Reserved interface | Supports RS232/RS485 |
| Controller Weight | 3.55KG |
| Controller Size | 232*170*165 mm |
| Power | 275W |
A1: Piezo jet valves require specially formulated, jettable solder pastes—typically Type 5 or finer—with low metal particle separation and stable rheology. The viscosity should be within the 50,000-150,000 mPa*s range to ensure consistent, clog-free jetting performance.
A2: Piezo jet valves offer nanoliter-level volume control with a repeatability of ±2% or better. This level of precision ensures uniform solder paste deposition across ultra-fine-pitch pads, improving solder joint quality and yield.
A3: Advanced jetting valves feature anti-clogging nozzle designs and optional nozzle heating to maintain paste viscosity. Proper paste filtration and routine maintenance help prevent nozzle blockage and ensure stable long-term operation.
Founded in 2008, Changzhou Mingseal Robot Technology Co., Ltd. is a technology-driven manufacturer of high-end equipment, specializing in connection, assembly, inspection systems, and key components for advanced semiconductor packaging and precision electronics. Our solutions are widely adopted by leading customers in sectors such as semiconductor packaging, consumer electronics, and automotive electronics. With a strong presence across Asia and the Americas, we deliver reliable support and innovation globally.
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