Eccentric 2K Screw Valve — 1~60 RPM Speed Range for Automotive Electronics Dispensing
Product Overview
This eccentric 2K screw valve meters thick adhesives and sealants using positive displacement via an eccentric screw. The low speed range (1~60 rpm) gives strong, steady feed for heavy pastes and reduces pulsation at the nozzle. The compact head is designed for robot end effectors and inline stations, with quick access for nozzle changes and cleaning to keep production running.
Problem
Automotive assembly can suffer from poor bond quality when pastes are not fed steadily or when deposit volume varies between cycles.
Cause
High‑viscosity materials need positive displacement and controlled drive. Pressure systems or weak drives can starve the nozzle, cause pulses or trap air — producing inconsistent beads, missed deposits or extra cleanup.
Solution
This eccentric screw valve delivers reliable positive displacement metering with controlled low rpm to handle dense adhesives. The short fluid path and robust wetted parts reduce air entrainment and wear. Standard nozzle options and a quick‑release head simplify tuning and maintenance, reducing line downtime.
Technical parameters
| Model | KDP1000 |
| Glue output per circle | 1ml |
| Flow rate | 2~40mL/min |
| Mixing ratio | 1:1~10:1 |
| Measuring accuracy | ±3% |
| Matching controller | KSC3000-D |
| Operating pressure | 0~0.6MPa |
| Maximum output pressure | 2.0MPa |
| Viscosity range | 1~1,000,000cP |
| Motor speed | 1~60rpm |
| Rotor material | Ceramic |
| Stator material | FKM/FFKM/EPDM |
Application
- Automotive electronics: adhesive dots and short beads for sensors, connectors, and control modules.
- Potting start and gap filling in battery module assemblies.
- Sealing and gasketing on small housings and connectors.
- Pilot and production lines requiring low‑speed, high‑torque metering of thick pastes.
How It Works
The eccentric screw rotates within a close clearance chamber to move material forward by positive displacement. Low rpm gives higher torque and steady feed for dense pastes; motor speed controls flow. Material passes through a short path to the nozzle, limiting dead volume and air traps, and the nozzle size plus pulse timing determine deposit volume and bead profile.
How To Choose
- Confirm required deposit volume and choose nozzle diameter accordingly.
- Provide adhesive viscosity at operating temperature so we can verify screw clearance and recommend wetted parts.
- Select feed method (pressure pot for long runs; gravity pot for bench work) and use a stable regulator when pressure feeding.
- Decide on motor and controller type (stepper or servo); add encoder feedback for tight repeatability.
- For abrasive or filled pastes, specify ceramic or coated parts and plan spare parts inventory.
- Request a bench trial with your material to finalize rpm, nozzle and pressure settings.
FAQ
Q1: Is the 1~60 rpm range suitable for very heavy pastes?
A1: Yes. The low rpm range provides higher torque to move heavy pastes; for very high throughput we recommend testing with your material to confirm settings.
Q2: What is the minimum deposit I can achieve?
A2: Minimum per‑shot volume is roughly 10 µL depending on nozzle and pulse control. For smaller nL or µL work consider a piezo or micro‑valve.
Q3: How often will nozzles need cleaning?
A3: Cleaning frequency depends on material solids and duty cycle. The quick‑release head minimizes downtime; keep spare nozzles to reduce interruptions.
Q4: Can one feed supply multiple heads?
A4: Yes. With proper manifold and regulator design, one supply can feed multiple valve heads; flow distribution depends on nozzle sizes and layout.
Q5: Do you offer integration and testing services?
A5: Yes. Mingseal provides bench trials, parameter tuning and on‑site commissioning. Send sample materials for tests and we will return logs and suggested settings.
About Mingseal
Founded in 2008, Changzhou Mingseal Robot Technology Co., Ltd. is a technology-driven manufacturer of high-end equipment, specializing in connection, assembly, inspection systems, and key components for advanced semiconductor packaging and precision electronics. Our solutions are widely adopted by leading customers in sectors such as semiconductor packaging, consumer electronics, and automotive electronics. With a strong presence across Asia and the Americas, we deliver reliable support and innovation globally.
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