Floor Standing Adhesive Dispensing Machine — 2150 × 800 mm Hot Melt Dispensing Equipment
Product overview
This floor‑standing system provides a stable platform for hot melt dispensing on large panels and assemblies. It combines a rigid gantry, configurable dispensing heads, and an onboard camera for part registration and inspection. The unit supports stored production recipes and standard factory interfaces for process logging.
Problem → Cause → Solution
Problem: Large parts need uniform adhesive application; inconsistent deposits lead to poor adhesion, cosmetic defects, and rework.
Cause: Temperature drift, long feed paths and inconsistent actuation timing cause deposit variation on larger surfaces.
Solution: The machine keeps feed temperature stable, positions heads precisely over a large work area, and uses camera‑based registration so deposits stay consistent across full panels.
Technical parameters
| Model | FS800S20 |
| Structure | Floor-standing gull-wing door layout |
| Dual XYZ motion module + dual tracks | |
| Transmission mode X axis / Y axis | X/Y Linear motor + grating ruler |
| Z Servo motor + lead screw module | |
| Number of axes | 6-axis (Dual XYZ Execution Unit) |
| Outer dimension(W×D×H) | 3000×1600×1600mm |
| Working range(W×D) | 2150×800mm |
| Maximum speed X axis/Y axis/Z axis | XY axis 1000mm/s Z axis 500mm/s |
| Maximum acceleration X axis/Y axis/Z axis | XY axis 1g Z axis 0.5g |
| Repeat positioning accuracy (3sigma) | XY axis ±0.015mm Z axis ±0.005mm |
| Positioning accuracy (3sigma) | XY axis ±0.03mm Z axis ±0.01mm |
| Track width adjustment method | Automatic width adjustment |
| Track width adjustment range | 150~400mm(Single track) |
| Z-axis load (kg) | 5 |
| Conveyor belt load (kg) | 10 |
| Maximum substrate thickness( mm) | 0.5~10mm |
| Maximum height allowed above the board | 25mm |
| Maximum height allowed under the board | 25mm |
| Conveyor track | Optional belt, chain, double speed chain(customized) |
| Camera pixels (optional) | 130W black and white (optional) |
| Light source | RGB color light source (optional) |
| Operating system | Win10 64-bit system |
| Input voltage | 220V AC 50±Hz |
Typical applications
- Large chassis and panel perimeter sealing in automotive electronics.
- Structural adhesive lines for frames and housings.
- Thermal pad placement and spot adhesive for large modules.
How the machine operates
- Prepare material: install cartridge or attach heated feed and set temperature.
- Load recipe & position part: place panel on table; camera locates references.
- Dispense: gantry moves heads to programmed positions and applies deposits per recipe.
- Inspect & record: camera verifies appearance; system logs recipe and run data.
How to choose
- For heavy or very large panels confirm the table load rating and fixture design.
- For filled or viscous adhesives use larger nozzle sizes.
- For very small dispensing confirm minimum deposit and timing with a sample run.
- For higher throughput add a second head or use larger tips and parallel patterns.
Installation & routine care
Installation: floor mounting; connect mains, compressed air (if needed), grounding and network I/O; ensure adequate floor support.
Commissioning: run part × nozzle × temperature × motion matrix to create validated recipes.
Maintenance: daily nozzle cleaning in heavy use; periodic heating element checks and monthly camera calibration.
FAQ
Q: What panel sizes can this machine handle?
A: Usable table area is 2150 × 800 mm; confirm fixture and part geometry for full coverage.
Q: How is temperature controlled for hot melt adhesives?
A: The system offers heated feed sleeve or heated feed line with ±1 °C stability at setpoint.
Q: Can this be integrated into an existing line?
A: Yes — standard digital I/O and optional communication protocols are supported for line sync and recipe exchange.
About Mingseal
Founded in 2008, Changzhou Mingseal Robot Technology Co., Ltd. is a technology-driven manufacturer of high-end equipment, specializing in connection, assembly, inspection systems, and key components for advanced semiconductor packaging and precision electronics. Our solutions are widely adopted by leading customers in sectors such as semiconductor packaging, consumer electronics, and automotive electronics. With a strong presence across Asia and the Americas, we deliver reliable support and innovation globally.
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