Custom Electronic Injection Molding Heat Dissipation Injection Plastic Parts Lightweight
General Electronic Heat Dissipation Structural Components
Electronic heat dissipation structural components are manufactured using engineering plastics such as PC+ABS, PA66+GF, and PBT through injection molding combined with optimized heat dissipation design. They are commonly used for heat dissipation, support, and protection within electronic devices.
- Material Preparation and Drying
- Injection Molding of Heat Sinks or Air Guides
- Surface Texture Treatment
- Functional Testing (Heat Dissipation Efficiency, Assembly Accuracy)
- Finished Product Packaging
| Parameter | Value Range/Description |
|---|---|
| Material | PC+ABS, PA66+GF, PBT |
| Accuracy | ±0.03 mm |
| Mold Life | 600,000–1,000,000 Cycles |
| Wall Thickness | 0.8–3 mm |
| Temperature Resistance | -20°C to 120°C |
| Features | Optimized heat dissipation, heat resistance, lightweight |
| Applications | Heat sink brackets, air guides |
| Molding Cycle | 12–25 seconds |
| Surface Treatment | Texture, Painting |
| Dimensions | Customizable |
Suitable for fan air guides, electronic cooling modules, and internal ventilation structures. Provides stable heat dissipation support.
- High-precision molding ensures airflow guidance
- Excellent heat resistance
- Lightweight, reduces equipment weight
- High assembly accuracy, suitable for complex structures
- Mass production possible
We can customize the heat dissipation structure shape, air guide design, snap-on connectors, logo, and more to meet the cooling needs of different electronic devices.
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