Durable Copper-Polyimide Composite Solution for Repeated Flexing Applications
The GL series sets a fresh benchmark in polyimide film performance. Our proprietary manufacturing technology builds a fundamentally enhanced molecular architecture, guaranteeing performance boosts of more than 30% in critical properties like tensile strength, dimensional stability, and chemical resistance over conventional options. This high-performance, natural yellow polyimide film can be customized in thickness, cementing its role as the essential material for mission-critical applications such as high-reliability adhesive substrates and advanced chip packaging.
Outstanding Mechanical Strength
Exceptional Dimensional Stability
Superior Laminating Properties
Conforms to RoHS and REACH regulations
-
High-density flexible copper clad laminates (FCCL) for FPC fabrication
-
Dimensionally stable coverlays for circuit protection
-
Advanced encapsulation and packaging for semiconductor devices
-
High-performance substrates for specialty adhesive tapes
To preserve the integrity and performance of our Polyimide film, please adhere to the following storage guidelines:
-
Shelf Life: 6 months from the manufacturing date.
-
Optimal Environment: Store in a cool, dry place with stable ambient conditions.
-
Protection Measures: Keep the original packaging sealed and protect from direct sunlight, moisture, and extreme temperatures.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.