FPC Film

Material Revolution This quantum-thin polyimide nanomembrane represents a breakthrough in flexible electronics, employing graphene-quantum-dot reinforcement and molecular-level self-assembly to achieve 1-8μm thickness with 95% higher folding endurance and 80% improved barrier properties versus conventional polyimide films. The material maintains >10 million flex cycles at 0.1mm radius while providing 5GPa tensile strength at 3μm thickness, enabling previously impossible

Product Overview This advanced polyimide coverlay film represents a breakthrough in circuit protection technology, combining a ultra-thin polyimide core (8-25μm) with functional adhesive layers to provide comprehensive protection for high-density circuits. Featuring 50% better flexibility and 40% higher temperature resistance than standard coverlay films, it offers superior solder mask replacement capability while ensuring long-term reliability in demanding applications. The

Ultra-Stable Polyimide Substrate for Precision Flexible Circuits Product Overview This revolutionary polyimide substrate incorporates proprietary molecular alignment technology and ceramic nano-reinforcements to achieve unprecedented dimensional stability (±0.01% dimensional change under 85°C/85% RH), representing a 60% improvement over conventional polyimide substrates. Designed for advanced flexible electronics requiring sub-micron registration accuracy, it maintains

5G & High-Speed Circuit Substrate Product Overview Our 5G & High-Speed Circuit Substrate is an advanced high-frequency material engineered to meet the rigorous demands of next-generation wireless and high-speed digital applications. With ultra-low dielectric loss and exceptional signal integrity performance, this substrate enables higher data rates, reduced power consumption, and enhanced reliability in 5G infrastructure, high-performance computing, and advanced automotive

Transparent Polyamide Imide Plastic film Dielectric Substrate 7.5um Detail Information Place of Origin: ANHUI, CHINA Certification: UL ISO ROHS Material: Polyimide Color: Yellow Treatment: Single-side / Both Sides Width: 514MM 520MM 1028MM 1040MM Thickness: 12.5μm 20μm 18μm 25μm Packing Style: Standard Packing Application: Roll Length: Customized Packaging Details: Wooden pallet Supply Ability: 2000 ton/year Highlight: High Thermally Conductive Polyimide Insulation Film for

Detail Information Place of Origin: ANHUI, CHINA Certification: UL ISO ROHS Material: Polyimide Color: Yellow Treatment: Single-side / Both Sides Width: 514MM 520MM 1028MM 1040MM Thickness: 12.5μm 20μm 18μm 25μm Packing Style: Standard Packing Application: Roll Length: Customized Packaging Details: Wooden pallet Supply Ability: 2000 ton/year Highlight: High Thermally Conductive Polyimide Insulation Film for Power Devices Product Description Thin Polyimide Coverlay Film for

Kapton Tape Conductive Polyimide Membrane Detail Information Place of Origin: ANHUI, CHINA Certification: UL ISO ROHS Material: Polyimide Color: Yellow Treatment: Single-side / Both Sides Width: 514MM 520MM 1028MM 1040MM Thickness: 12.5μm 20μm 18μm 25μm Packing Style: Standard Packing Application: Roll Length: Customized Packaging Details: Wooden pallet Supply Ability: 2000 ton/year Highlight: High Thermally Conductive Polyimide Insulation Film for Power Devices Product

Detail Information Place of Origin: ANHUI, CHINA Certification: UL ISO ROHS Material: Polyimide Color: Yellow Treatment: Single-side / Both Sides Width: 514MM 520MM 1028MM 1040MM Thickness: 12.5μm 20μm 18μm 25μm Packing Style: Standard Packing Application: Roll Length: Customized Packaging Details: Wooden pallet Supply Ability: 2000 ton/year Highlight: High Thermally Conductive Polyimide Insulation Film for Power Devices Product Description Thin Polyimide Coverlay Film for

Flexible Printed Circuit Base Polyimide Substrate Paper Film Detail Information Place of Origin: ANHUI, CHINA Certification: UL ISO ROHS Material: Polyimide Color: Yellow Treatment: Single-side / Both Sides Width: 514MM 520MM 1028MM 1040MM Thickness: 12.5μm 20μm 18μm 25μm Packing Style: Standard Packing Application: Roll Length: Customized Packaging Details: Wooden pallet Supply Ability: 2000 ton/year Highlight: High Thermally Conductive Polyimide Insulation Film for Power

Black Glossy Polyester PI FPC Film Material High Temperature Resistant Detail Information Place of Origin: ANHUI, CHINA Certification: UL ISO ROHS Material: Polyimide Color: Yellow Treatment: Single-side / Both Sides Width: 514MM 520MM 1028MM 1040MM Thickness: 12.5μm 20μm 18μm 25μm Packing Style: Standard Packing Application: Roll Length: Customized Packaging Details: Wooden pallet Supply Ability: 2000 ton/year Highlight: High Thermally Conductive Polyimide Insulation Film

Polyimide Core Film for Flexible Printed Circuits & Semiconductor Packaging Fields Detail Information Place of Origin: ANHUI, CHINA Certification: UL ISO ROHS Material: Polyimide Color: Yellow Treatment: Single-side / Both Sides Width: 514MM 520MM 1028MM 1040MM Thickness: 12.5μm 20μm 18μm 25μm Packing Style: Standard Packing Application: Roll Length: Customized Packaging Details: Wooden pallet Supply Ability: 2000 ton/year Highlight: High Thermally Conductive Polyimide

Polyimide Core Film Used in Flexible Printed Circuits and Semiconductor Packaging Detail Information Place of Origin: ANHUI, CHINA Certification: UL ISO ROHS Material: Polyimide Color: Yellow Treatment: Single-side / Both Sides Width: 514MM 520MM 1028MM 1040MM Thickness: 12.5μm 20μm 18μm 25μm Packing Style: Standard Packing Application: Roll Length: Customized Packaging Details: Wooden pallet Supply Ability: 2000 ton/year Highlight: High Thermally Conductive Polyimide

FPC Film-Black Polyimide FPC Film of High Adhesion Strength for Flexible Circuits Product Overview GB-Type Black Polyimide Film delivers a unique blend of outstanding thermal stability, electrical insulation, and dimensional reliability. The opaque black film is extensively utilized in electronics, flexible circuits, and semiconductor packaging, offering high performance while simultaneously addressing the need for critical light-blocking protection. Key Specifications Place

FPC Film-Standard Black Opaque Polyimide Composite Flexible Circuit Substrate Product Overview GB-Type Black Polyimide Film delivers a unique blend of outstanding thermal stability, electrical insulation, and dimensional reliability. The opaque black film is extensively utilized in electronics, flexible circuits, and semiconductor packaging, offering high performance while simultaneously addressing the need for critical light-blocking protection. Key Specifications Place of

Conventional Black PI Polyimide FPC Film Silicone Coated Paper Detail Information Place of Origin: ANHUI, CHINA Certification: UL ISO ROHS Material: Polyimide Color: Yellow Treatment: Single-side / Both Sides Width: 514MM 520MM 1028MM 1040MM Thickness: 12.5μm 20μm 18μm 25μm Packing Style: Standard Packing Application: Roll Length: Customized Packaging Details: Wooden pallet Supply Ability: 2000 ton/year Highlight: High Thermally Conductive Polyimide Insulation Film for Power

Durable Copper-Polyimide Composite Solution for Repeated Flexing Applications Product Overview: The GL series sets a fresh benchmark in polyimide film performance. Our proprietary manufacturing technology builds a fundamentally enhanced molecular architecture, guaranteeing performance boosts of more than 30% in critical properties like tensile strength, dimensional stability, and chemical resistance over conventional options. This high-performance, natural yellow polyimide

Matte Polyimide Black Film Paper For FPC Coverlay Detail Information Place of Origin: ANHUI, CHINA Certification: UL ISO ROHS Material: Polyimide Color: Yellow Treatment: Single-side / Both Sides Width: 514MM 520MM 1028MM 1040MM Thickness: 12.5μm 20μm 18μm 25μm Packing Style: Standard Packing Application: Roll Length: Customized Packaging Details: Wooden pallet Supply Ability: 2000 ton/year Highlight: High Thermally Conductive Polyimide Insulation Film for Power Devices

Colorless Polyimide Film Product Specifications Attribute Value Temperature Resistance Up to 200°C Dielectric Constant 3.4 Flexibility Highly Flexible Material Polyimide Conductivity Highly Conductive Circuit Layers Single-sided, Double-sided, Multi-layer Surface Finish Immersion Gold Thickness 5μm-100μm Width 1040mm Product Overview Colorless Polyimide Film is an advanced high-performance transparent polymer film that combines exceptional thermal stability, mechanical

Colorless Polyimide Film Product Specifications Attribute Value Temperature Resistance Up to 200°C Dielectric Constant 3.4 Flexibility Highly Flexible Material Polyimide Conductivity Highly Conductive Circuit Layers Single-sided, Double-sided, Multi-layer Surface Finish Immersion Gold Thickness 5μm-100μm Width 1040mm Product Overview Colorless Polyimide Film is an advanced high-performance transparent polymer film that combines exceptional thermal stability, mechanical