Dielectric Film

Quantum-Shielded GL-25(C) Extreme-Environment Nano-Composite Substrate Quantum-Enhanced Material Architecture The GL-25(C) represents a fundamental breakthrough in high-temperature substrate technology, incorporating quantum dot-reinforced polymer matrices and multi-dimensional nanoceramic alignment to achieve 50% superior thermal endurance and 55% enhanced dimensional invariance versus conventional polyimide substrates. Engineered through proprietary molecular self-assembly

GL-25(C) Ultra-High-Temperature Polyimide Substrate with Quantum Reinforcement Technology Utilizing patented molecular architecture, our GL platform embodies a self-developed biaxially-oriented polyimide matrix with inherent amber chromatic properties. The series offers tri-tiered calibration profiles with tailored molecular configurations, purpose-formulated for elite isolation strata within sophisticated microelectronic encapsulation architectures and exacting adhesion

Advanced Dielectric Encapsulation Solution for Next-Generation Flexible Hybrid Electronics Detail Information Place of Origin: ANHUI, CHINA Certification: UL ISO ROHS Material: Polyimide Color: Yellow Treatment: Single-side / Both Sides Width: 514MM 520MM 1028MM 1040MM Thickness: 5μm -100μm Packing Style: Standard Packing Application: Roll Length: Customized Packaging Details: Wooden pallet Supply Ability: 2000 ton/year Product Description The GL series redefines the

High-Performance Isolation Film for Flexible Hybrid Systems Detail Information Place of Origin: ANHUI, CHINA Certification: UL ISO ROHS Material: Polyimide Color: Yellow Treatment: Single-side / Both Sides Width: 514MM 520MM 1028MM 1040MM Thickness: 5μm -100μm Packing Style: Standard Packing Application: Roll Length: Customized Packaging Details: Wooden pallet Supply Ability: 2000 ton/year Highlight: Low Dielectric Constant Polyimide Substrate for FPCs Product Description The

Detail Information Place of Origin: ANHUI, CHINA Certification: UL ISO ROHS Material: Polyimide Color: Yellow Treatment: Single-side / Both Sides Width: 514MM 520MM 1028MM 1040MM Thickness: 5μm 7.5μm 11μm 12.5μm 25μm 50μm 70μm 75μm 100μm Packing Style: Standard Packing Application: Roll Length: Customized Packaging Details: Wooden pallet Supply Ability: 2000 ton/year Highlight: Low-Dk Polyimide Insulating Film for Flexible Circuit Boards Thermally Stable Dielectric Barrier

FHE Insulation Dielectric Film for Flexible Hybrid Electronics () Detail Information Place of Origin: ANHUI, CHINA Certification: UL ISO ROHS Material: Polyimide Color: Yellow Treatment: Single-side / Both Sides Width: 514MM 520MM 1028MM 1040MM Thickness: 5μm 7.5μm 11μm 12.5μm 25μm 50μm 70μm 75μm 100μm Packing Style: Standard Packing Application: Roll Length: Customized Packaging Details: Wooden pallet Supply Ability: 2000 ton/year Highlight: Low-Dk Polyimide Insulating Film

high temp Dielectric Film No Adhesive For Capacitor Detail Information Place of Origin: ANHUI, CHINA Certification: UL ISO ROHS Material: Polyimide Color: Yellow Treatment: Single-side / Both Sides Width: 514MM 520MM 1028MM 1040MM Thickness: 5μm 7.5μm 11μm 12.5μm 25μm 50μm 70μm 75μm 100μm Packing Style: Standard Packing Application: Roll Length: Customized Packaging Details: Wooden pallet Supply Ability: 2000 ton/year Highlight: Low-Dk Polyimide Insulating Film for Flexible

Low-Dk Polyimide Insulating Dielectric Film for Flexible Circuit Boards Detail Information Place of Origin: ANHUI, CHINA Certification: UL ISO ROHS Material: Polyimide Color: Yellow Treatment: Single-side / Both Sides Width: 514MM 520MM 1028MM 1040MM Thickness: 5μm 7.5μm 11μm 12.5μm 25μm 50μm 70μm 75μm 100μm Packing Style: Standard Packing Application: Roll Length: Customized Packaging Details: Wooden pallet Supply Ability: 2000 ton/year Highlight: Low-Dk Polyimide Insulating

GL50 High-Temperature Resistant Polyimide Matrix with Inherent Spectral Filtering Properties Leveraging proprietary macromolecular design, our Generation-Lambda technology platform integrates autogenously synthesized biaxially-aligned polyimide networks exhibiting intrinsic spectral transmission characteristics. The product ecosystem provides trichotomous performance gradations with engineered polymer morphologies, specifically architected for premium dielectric interlayers

GL-25(C) Advanced Thermostable Polyimide Amber Substrate Utilizing patented molecular architecture, our GL platform embodies a self-developed biaxially-oriented polyimide matrix with inherent amber chromatic properties. The series offers tri-tiered calibration profiles with tailored molecular configurations, purpose-formulated for elite isolation strata within sophisticated microelectronic encapsulation architectures and exacting adhesion-critical substrate implementations.

GL-12.5 High- Polyimide Polyimide Yellow Film Developed through proprietary technology, the GL film series represents our autonomously engineered biaxially-stretched polyimide material in intrinsic amber coloration. This product line features three specialized gauge variants with customized material compositions, specifically engineered for high-performance dielectric layers in advanced encapsulation systems and precision bonding substrate applications. Key Advantages:

Detail Information Place of Origin: ANHUI, CHINA Certification: UL ISO ROHS Material: Polyimide Color: Yellow Treatment: Single-side / Both Sides Width: 514MM 520MM 1028MM 1040MM Thickness: 5μm 7.5μm 11μm 12.5μm 25μm 50μm 70μm 75μm 100μm Packing Style: Standard Packing Application: Roll Length: Customized Packaging Details: Wooden pallet Supply Ability: 2000 ton/year Highlight: Low-Dk Polyimide Insulating Film for Flexible Circuit Boards Product Description Low-Dk Polyimide

Low-Dk Polyimide Film GL-25G for High-Speed Electronics Product Overview Low-Dielectric Polyimide Film (Low-Dk PI Film) is an advanced polymer material engineered to exhibit ultra-low dielectric constant (Dk < 3.0) and minimal dielectric loss (Df < 0.005) across high-frequency ranges (1 MHz-100 GHz). It retains the intrinsic thermal stability (>300°C) and mechanical robustness of polyimide while addressing signal integrity demands in high-speed electronics. Key Characteristic