Polyimide Film for Electrical Insulation and Protection

The GL premium-grade polyimide film is a dual-axis oriented intrinsic yellow-hued variant, independently R&D and manufactured in-house by our enterprise. Offered in three distinct thickness options with tailored performance traits, this proprietary material is predominantly utilized for adhesive base substrates and semiconductor chip encapsulation applications.

This material delivers exceptionally robust mechanical performance and boasts an ultra-low coefficient of thermal expansion. It also exhibits superior surface adhesion capabilities for enhanced compatibility. Furthermore, the product fully meets RoHS and REACH regulatory standards, and has obtained official safety certification from the U.S.-based UL Laboratories.

Our proprietary GL premium-grade polyimide film is predominantly applied to precision-engineered adhesive FCCL substrates, superior-stability cover films, semiconductor chip encapsulation, and specialized adhesive tape base materials.

To ensure the longevity and performance of our Polyimide film, please adhere to the following guidelines:

• Shelf Life: 6 months from the date of manufacture.
• Storage Conditions:
  • Store in a cool, dry place away from direct sunlight will be necessary.
  • Avoid exposure to high humidity or extreme temperature fluctuations.