Custom Polyimide Thin Film Options for PCB, FPC, and Thermal Barriers

It exhibits exceptional mechanical strength and performance.

It features an ultra-low coefficient of thermal expansion.

It delivers outstanding surface adhesion and bonding characteristics.

This product meets RoHS and REACH standards and has obtained safety certifications from UL Laboratories in the United States.

Product Applications

GL series high-performance polyimide film is mainly applied to high-precision adhesive FCCL base materials, high-stability coverlay films, chip encapsulation, as well as substrates for specialty adhesive tapes.

To ensure the longevity and performance of our Polyimide film, please adhere to the following guidelines:

• Shelf Life: 6 months from the date of manufacture.
• Storage Conditions:
  • Store in a cool, dry place away from direct sunlight will be necessary.
  • Avoid exposure to high humidity or extreme temperature fluctuations.