130KV Electronics X Ray Inspection Machine For 300mm Sample Size
Price:
Negotiable
MOQ:
1
Delivery Time:
Negotiable
Brand:
WELLMAN
Product Description
Compact and Space-Saving 3D X-Ray Inspection System
Ultra-table design for small-sized PCBA boards and semiconductor packaging products with high scanning accuracy and easy operation.
Key Equipment Features
- Compact structure with minimal space requirements
- One-click full-process automation for data scanning, 3D reconstruction, and image analysis
- High precision scanning capabilities
Inspection Applications
- Small-sized PCBA boards
- Internal structure quality of semiconductor packaging products
- SMT solder joint quality inspection including:
- Cold solder joints
- Wetting issues
- Solder volume analysis
- Component offset detection
- Foreign object identification
- Bridging detection
- Pin presence verification
Technical Specifications
Ray Source Parameters
| Type of ray tube | Closed tube X-ray source |
|---|---|
| Tube voltage range (T-130) | 40-130 KV |
Detector Parameters
| Detector type | Amorphous silicon flat panel detector |
|---|---|
| Pixel size (T-130) | 100μm |
| Pixel matrix (T-130) | 1536x1536 |
Equipment Performance Parameters
| Maximum sample size (T-130) | Diameter: 300mm * Height: 320mm |
|---|---|
| Maximum imaging area (T-130) | Diameter: 200mm * Height: 120mm |
| JIMA card resolution | 3μm |
| Equipment weight (T-130) | 1T |
| Equipment dimensions (T-130) | 2150mm * 900mm * 1750mm (L*W*H) |
Imaging Software System
- Integrated scanning imaging software
- 3D image reconstruction software
- 3D image measurement and analysis software
- Image database management software
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
SHENZHEN WEIMING PHOTOELECTRIC CO.,LTD.
Location
5F,B3, Anda ElectronicsIndustrial Factory, HepingCommunity, Fuhai Street, BaoanDistrict, Shenzhen
Contact Person
Jeff Chan