SHENZHEN WEIMING PHOTOELECTRIC CO.,LTD.
                                                                                                           
Verified Supplier
8 Years
Since 2018
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530x530mm Oversized stage and 10KG Capacity load for Microfocus X-Ray Inspection System

Price Negotiable
Price: Negotiable
MOQ: 1
Delivery Time: 7 work days
Brand: WELLMAN
Product Description
530x530mm Oversized Stage with 10KG Capacity Load Microfocus X-Ray Inspection System
Key Advantages
  • Speed adjustable 5-axis linkage system
  • New generation 5" HD digital flat panel detector
  • 530×530mm table with 10KG load capacity
  • FPD tilts up to 60° without sacrificing magnification
  • Automatic navigation window - table moves to clicked positions
  • Programmable inspection procedures for automated batch inspection
  • Intuitive operation with minimal training required
  • Closed type X-ray tube with over 10,000 hours lifetime, maintenance-free operation
Working Principle
Diagram illustrating the working principle of 5-axis semiconductor inspection equipment showing X-ray source, detector, and sample positioning
Hardware Parameters
X-ray Source
TypeClosed, microfocus
Max Tube Voltage90kV
Max Tube Current200μA
Focal Spot Size5μm
FunctionAuto preheat
Flat Panel Detector
Effective Area130mm×130mm
Pixel Size85μm
Resolution1536×1536
Frame Rate20fps
Tiltable Angle60°
Table
Size530mm×530mm
Detectable Area500mm×500mm
Max Load10kg
Equipment Specifications
MagnificationGeometry 200X | System 1500X
Inspection SpeedMax 3.0s/point
Dimensions1360mm (L) × 1365mm (W) × 1730mm (H)
Weight1200kg
Power SupplyAC110-220V 50/60HZ
Max Power1500W
Industrial PCI5 CPU, 8G RAM, 500GB SSD
Displayer24" HDMI LCD
Software Functionality
Core Operations
Function ModuleKeyboard and mouse complete all operations
X-ray Tube ControlMouse-click activation with real-time voltage/current display and adjustable parameters
Status BarVisual indicators for interlock status, pre-heat status, and X-ray status
Image Effect AdjustmentAdjustable brightness, contrast and gain for optimal imaging
Product ListSave and recall inspection parameters for improved efficiency
Navigation WindowClick-to-move table positioning with camera guidance
Motion Axis StatusReal-time coordinate display
Inspection ResultOrganized display of measurement results including voids rate, distance, area
Speed ControlAdjustable movement speed for each axis (slow, normal, fast)
Voids Rate Measurement
Automatic CalculationRectangle-based solder ball analysis with automatic void detection and NG/OK indication
Parameters AdjustmentCustomizable grayscale threshold, pixel, contrast, and size filtering parameters
Add Voids ManuallyPolygon or free-form drawing for manual void inclusion
Save ParametersStore and recall measurement parameters for consistent product inspection
Additional Measurement Functions
DistanceVertical distance measurement from point to baseline
Distance RatePercentage ratio calculation for through-hole soldering rate measurement
AngleAngle measurement between defined rays
RadiusCircle measurement for round components with circumference, area and radius calculation
PerimeterSquare component measurement with length, width and area calculation
Automatic Inspection
Manual SettingCustom inspection point positioning with automatic inspection and image saving
ArrayAutomated inspection of regular patterns using row and column configuration
Automatic IdentificationFeature-based automatic position identification with measurement and image capture
Safety Features
Radiation LeakageNo leakage
Lead Glass Observation WindowTransparent lead glass window shields radiation to observe inner status
Window and Back Door Safety InterlockAutomatic X-ray power off when opened
Electromagnetic Safety SwitchLocks observation window when X-ray is active
Emergency StopLocated near operation position for immediate power cutoff
Tube ProtectionPrevents software exit without proper X-ray tube shutdown
Application Examples
BGA solder bridge inspection example showing connection defects
BGA Solder Bridge
BGA solder voids analysis showing internal cavity defects
BGA Solder Voids
PCB through-hole inspection showing solder fill quality
PCB Through-Hole
IC voids and gold wire inspection showing internal connections
IC Voids and Gold Wire
LED solder voids analysis showing connection quality
LED Solder Voids
LED gold wire crack detection showing fracture analysis
LED Gold Wire Crack
Capacitor internal structure inspection
Capacitor
Inductor component quality inspection
Inductor
Sensor internal structure analysis
Sensor
Thyristor surge suppressors internal inspection
Thyristor Surge Suppressors
Fiberglass material analysis
Fiberglass
Cable internal structure inspection
Cable
Diode component quality analysis
Diode
Steel pipe welding gap measurement
Steel Pipe Welding Gap
Automotive electronics component inspection
Automotive Electronics

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company SHENZHEN WEIMING PHOTOELECTRIC CO.,LTD.
Location 5F,B3, Anda ElectronicsIndustrial Factory, HepingCommunity, Fuhai Street, BaoanDistrict, Shenzhen
Contact Person Jeff Chan

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