99.9% High Purity 0.5um Sub Micro Spherical Silica Powder Silica Sphere Microsphere SS-H Series
Sub-Micro High Purity Spherical Silica Powder
SS-H-05
Introduction:
This product with high spherical rate and high purity.The particle size and distribution can be adjustable.The product has been successfully applied to EMC, CCL and other fields as filling material, which can greatly improve the rigidity, wear resistance, weather resistance, impact resistance, tension resistance, fire resistance, arc insulation resistance and ultraviolet radiation resistance of electronic products.
Characteristic: SiO2 > 99.9%
Application:
EMC, CCL, Photovoltaic crucible Coating, Special Coating, Ink, Special Ceramic Materials, Engineering plastics,etc.
Product Parameter:
| ITEM | Unit | SS-H-05 |
|---|---|---|
| Particle Size(D50) | um | 0.5 ± 0.1 |
| Spherical rate | % | > 95 |
| Whiteness | -- | > 92 |
| SiO2 | % | > 99.9 |
| Density | g/cm3 | 2.1 ± 0.1 |
| S.S.A. | m2/g | 15 ± 5 |
Above specification are for common uses,and can be adjusted upon user’s request.
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